Semiconductor Metallization
Metal Nanostructures
Aqueous Battery
Our research focuses on electrochemical processes for advanced semiconductor packaging and the fabrication of metal interconnects. Through fundamental and applied studies of electrodeposition, we develop materials and processes for TSVs, TGVs, microbumps, RDLs, hybrid bonding, and next-generation fine-pitch interconnects. We also investigate the growth mechanisms of metallic nanostructures and electrochemical interfaces to enable reliable and scalable manufacturing technologies for future electronic systems.
Interviews for prospective undergraduate research interns will be conducted through July 24, 2026. Interested students are encouraged to contact Dr. MJ Kim (mjkim09@skku.edu) to schedule an interview.