Embedded Files
PROJECT 1
• Computational Techniques for Electronic Packaging / Spring 2020
Calculated effect of thermal enhancements on micro-electronic systems (Analysis: ANSYS ICEPAK). Compared the effect of padding, mold, and lid type of enhancements; evaluated the significance of heat sink height on heat dissipation from flip chip BGA package.
PROJECT 2
• Fracture Mechanics / Spring 2019
Determined stress concentration parameters on a cracked structure using Finite Element Method (FEM). Calculated the effect of initial crack length on a surface and decided on the failure criteria (Analytical: MATLAB, Computational: ANSYS).
PROJECT 3
• Additive Manufacturing / Spring 2020
Developed human face and skull model (CAD model: SolidWorks) for location-focused impact test by using extrusion-based additive manufacturing. Shows successful implementation of extrusion-based additive manufacturing process (Extrusion: FlashForge Creator Pro) which builds economic and fast batch of impact test model required to detect injure-prone human body parts (Analysis: ANSYS).
PROJECT 4
• Computational Materials Science / Spring 2018
Calculated the deformation of Silicon Carbide system based on the extent of defect using LAMMPS.
PROJECT 5
• Advanced Mechanics of Materials / Fall 2016
Analyzed effect of cavitation bubble collapse and microjets on viscoelastic brain axon model using ANSYS.
PROJECT 6
• Senior Capstone Design / Fall 2015
Designed an economic overload detection system for local maritime vehicles in Bangladesh at experimental prototype level based on ball-and-pipe overload detection and LED light warning system.
Page updated
Google Sites
Report abuse