Electrochemical deposition: Metallic and semiconductor nanostructured films (CuO, ZnO, CoP). Electrocatalyst fabrication (W3CoB3, NiMoB, CoMnB, NiMnB, W/NiBP).
Hydrothermal deposition: Electrocatalyst fabrication (NiBP, V/FeBP, Ru/NiBP, CoFeBP, Ru/NiMnB, Ru/CuMnBP, Mn/NiBP, CuBP, W/NiBP, Cr/NiBP, FeMoB, Ru/CuBP, , FeMoB, VNiBP )
Physical vapor deposition: pulsed laser deposition (PLD), sputtering, rapid thermal process (RTP), plasmonic nanostructures (Ag, Au, Pd, Pt, Cu) on various substrates (sapphire, GaN, Si, FTO), chemical vapor deposition (CVD) .
Solution-based synthesis and deposition: Plasmonic nanostructures, semiconductor quantum dots (ZnO, TiO2), perovskites (CsPbBr3), semiconductor thin films (ZnO, TiO2, CuO), spin coating.
Electronics device application: Construction of Voltage series feedback amplifier, Arithmetic Circuit, SCR & UJT Circuit, and Oscillator connection.
Characterization techniques: atomic force microscopy (AFM), scanning electron Microscopy (SEM), Transmission Electron Microscopy (TEM), Energy dispersive x-ray spectroscopy (EDS), Raman spectroscopy, photoluminescence (PL) spectroscopy, UV-VIS spectroscopy, I-V (Photo response) measurements, X-ray powder diffraction (XRD) spectroscopy, X-ray photoelectron spectroscopy (XPS), electrochemical analysis (LSV, CV, CA, CP, and EIS), Dense Plasma Focus Device (DPF), BET (Brunauer-Emmett-Teller) analysis, Inductively Coupled Plasma (ICP) analysis.
Simulation and software: Finite-difference time-domain (FDTD), Origin, Sigma plot.
Major lab experience: Electronics & Electrical communication (Optoelectronics), Digital Electronics Lab, Nuclear physics Lab, Electromagnetic Lab, Electronics Lab, Optics Lab, Chemistry sessional Lab, Electricity Lab, Acoustic Lab, and Mechanics Lab