The Light Taiwan Research Group focuses on the integrated development of advanced semiconductor materials and intelligent infrared sensing systems through the combination of computational simulation, experimental characterization, and circuit-system integration.

In the area of materials design, our research combines density functional theory (DFT), high-throughput computing (HTC), machine learning (ML), and feature engineering to predict the electronic transport properties, defect behavior, interface characteristics, and growth mechanisms of emerging semiconductor materials. By integrating data-driven approaches with first-principles calculations, we establish predictive models for material discovery, process optimization, and device performance enhancement.

For infrared sensing technologies, our laboratory adopts a comprehensive system-level research framework that spans from active material synthesis to device fabrication, characterization, and analog front-end circuit integration. We investigate advanced infrared absorber materials, including quantum dots and hybrid optoelectronic semiconductors, and develop photodetector architectures optimized for high sensitivity, low noise, and low-power operation.

Our simulation platform integrates DFT for atomistic and electronic structure analysis, TCAD for semiconductor device modeling, and SPICE for analog circuit and sensing system design. These computational approaches are closely coupled with experimental fabrication and characterization techniques to enable simulation-assisted process optimization and backward inference analysis.

Current research interests include:

• High-throughput computational screening of semiconductor materials

• Quantum dot and hybrid infrared optoelectronic devices

• Defect engineering and trap-state characterization

• Carrier transport dynamics and interface physics

• AI-assisted semiconductor process optimization

• TCAD-SPICE co-simulation for sensor and circuit integration

• Low-resistivity conductors and heterogeneous integration materials

• Intelligent infrared sensing systems for AI, biomedical, and autonomous applications

Through the integration of materials science, semiconductor devices, and intelligent sensing systems, the group aims to accelerate the development of next-generation electronic and optoelectronic technologies.

-Nikola Tesla