Research
Research
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Monolithic 3D integration of heterogeneous single-crystalline semiconductors
Monolithic 3D integration of heterogeneous single-crystalline semiconductors
Collaboration with KNU and MIT
Collaboration with KNU and MIT
- Mechanical layer release techniques for freestanding membranes of III-V/III-N/Si
- Layer-releasable remote epitaxy and 2D material-based layer transfer
- Direct bonding-based reliable layer transfer technique for monolithic 3D integration
Monolithically integrated Si photonics on a single chip (via layer release/transfer)
Monolithically integrated Si photonics on a single chip (via layer release/transfer)
Collaboration with ETRI
Collaboration with ETRI
- Design/fabrication of low-footprint/high-speed/low-power active photonic devices and low-loss passive
devices together with Si CMOS electronic devices on a single chip
devices together with Si CMOS electronic devices on a single chip
- Co-integration of III-V layers on Si(100) to overcome limited optical properties of Si
- III-V membrane laser on SiC beyond 200 Gbps (for B5G/6G)
Nano-optoelectronics & electronics
Nano-optoelectronics & electronics
Collaboration with KNU and ETRI
Collaboration with KNU and ETRI
- Ultra-high-speed/low-power meta-structured microcavity technology for Si photonics
- Nano-scale GaN power/RF HEMT fabrication and characterization
Novel characterization techniques for semiconductor materials and devices
Novel characterization techniques for semiconductor materials and devices
Collaboration with KNU
Collaboration with KNU
- Electrical contact and defect evaluation based on I–V/C–V characterization
- FinFET/GAAFET contact modeling and characterization
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