Interfacial Engineering for Biointerfaces and Bioelectronic Devices
We aim to provide innovative solutions across diverse applications —including nerve regeneration, biosensing, and implantable electronic devices—by maximizing the performance of cell-material interactions and bioelectronic systems through advanced interfacial engineering techniques.
우리 연구실에서는 첨단 인터페이스 공학 기법을 통해 세포–물질 상호작용 및 전자–생체 장치의 성능을 극대화하는 연구를 합니다.
이러한 연구를 통해, 신경 재생, 바이오센싱, 이식형 전자 소자 등 다양한 응용 분야에서 해결되지 못했던 문제들을 해결하고자 합니다.
The strategic design of 3-dimensional microenvironments is crucial to understanding cell-material interactions and reducing the signal-to-noise ratio (SNR) sensitivity for neural electrodes. Among 3D structures, we focus on vertically standing high-aspect-ratio structures, which can penetrate the cytosol of cells with minimal perturbation to cells/tissues.
The high-aspect-ratio structures can further be integrated with conductive electrode devices such as microelectrode array (MEA), providing an interfacial layer between a live cell and an electrical instrument and enabling us to record and even stimulate the biointerfaces.
The major disadvantage of standard devices for biomedical applications comes from interfacial mismatch because most of the devices are made of metals, metal alloys, and silicon-based materials, which are rigid. This negatively affects foreign body reactions to the sensitivity and functionality of the implanted devices.
To minimize these, we are aimed to introduce nanosized coatings synthesized via initiated chemical vapor deposition (iCVD) to tailor the surface properties. These nanocoatings can serve primary functions such as surface protection and anti-corrosions but can also be used for additional purposes, including drug delivery, growth factor immobilization, etc.
Their environmental stability should be guaranteed for flexible, lightweight organic electronics to be used in biomedical applications. At the same time, their high operational voltage, which disturbs ion concentration gradients and induces action potentials, needs to be reduced. We aim to achieve these requirements by introducing novel, hybrid insulating layers.
The mechanical robustness of the device and the whole circuitry will be secured by studying interfacial adhesions between layers. Conjugation of DNA, antibodies, and nanoparticles directly onto the device's top surface will be investigated to increase sensors’ sensitivity and specificity.