*: Corresponding author
[34] *Junyong Park, Yuandong Guo, Bo Pu, DongHyun Kim, and Jun Fan, "De-Embedding for Coupled Three-Port Devices," in IEEE Transactions on Signal and Power Integrity, vol. 4, pp. 185-190, 2025.
[33] *Junyong Park, Reza Vahdani, DongHyun Kim, "Measurement- and Simulated Annealing (SA) Optimization-Based Inductor Model Coupled to Chassis," in IEEE Transactions on Instrumentation and Measurement, vol. 74, pp. 1-11, 2025, Art no. 2013711.
[32] *Junyong Park, Yuandong Guo, Xiaoning Ye, and DongHyun Kim, "Extraction of Dkglass and Dkresin for PCB Striplines and Analysis of Far-End Crosstalk," in IEEE Transactions on Signal and Power Integrity, vol. 4, pp. 149-155, 2025.
[31] *Manish Mathew, Xiao-Ding Cai, Chaofeng Li, Mehdi Mousavi, Reza Asadi, Junyong Park, Shameem Ahmed, Bidyut Sen, DongHyun Kim, "Generalized Mixed-Mode S-Parameter Framework for Accurate Multipair Crosstalk Analysis in High-Speed Digital Channels," in IEEE Transactions on Signal and Power Integrity, vol. 4, pp. 96-108, 2025.
[30] *Junyong Park, Yuandong Guo, Hongseok Kim, Jun Fan, and DongHyun Kim, "Accurate and Broadband Three-Phase Motor Modeling Methodology Based on Vector Fitting," in IEEE Transactions on Signal and Power Integrity, vol. 4, pp. 81-87, 2025.
[29] Pranay Vuppunutala, Xiaolu Zhu, *Junyong Park, Keith B. Hardin, Zachary Kratzer, John Fessler, Biyao Zhao, and Siqi Bai, "System Level Application of the Z-Directed Component (ZDC) for Power Integrity," in IEEE Transactions on Signal and Power Integrity, vol. 4, pp. 10-18, 2025.
[28] *Junyong Park, "Statistical Signal Integrity Analysis on DFE with Nonideal Latch Model," in Electronics 2025, 14, 202.
[27] *Junyong Park and Hyunwook Park, "System-Level Statistical Eye Diagram for Signal Integrity," in Electronics 2024, 13, 4387.
[26] *Chaofeng Li, Kevin Cai, Manish Mathew, Junyong Park, Mehdi Mousavi, Shameem Ahmed, Bidyut Sen, and DongHyun Kim, "Effective High-Speed Via Model Considering Equivalent High-order Mode Inductance," in IEEE Transactions on Signal and Power Integrity, vol. 3, pp. 169-177, 2024.
[25] *Junyong Park, Chaofeng Li, Joe Dickson, Joan Tourne, Aritharan Thurairajaratnam, and DongHyun Kim, "A Novel Vertical Conductive Structure for Printed Circuit Boards and its Scalable Model," in IEEE Transactions on Signal and Power Integrity, vol. 3, pp. 67-74, 2024.
[24] *Junyong Park, Manho Lee, Shinyoung Park, Jonghoon Kim, Joungho Kim and DongHyun Kim, "Controller Area Network With Flexible Data Rate (CAN FD) Eye Diagram Prediction," in IEEE Transactions on Electromagnetic Compatibility, vol. 66, no. 3, pp. 949-959, June 2024.
[23] *Junyong Park and DongHyun Kim, "Statistical Eye Diagrams for High-Speed Interconnects of Packages: A Review," in IEEE Access, vol. 12, pp. 22880-22891, 2024.
[22] *Junyong Park and Donghyun Kim, "A Statistical Shmoo for a Decision Feedback Equalizer (DFE)," in IEEE Access, vol. 11, pp. 134878-134886, 2023.
[21] *Junyong Park, Youngwoo Kim and Donghyun Kim, "Accelerated Statistical Eye Diagram Estimation Method for Efficient Signal Integrity Analysis," in IEEE Access, vol. 11, pp. 132699-132707, 2023.
[20] *Shuye Zhang, Junyong Park, Gapyeol Park, Huijin Song, Joungho Kim, Kyung-Wook Paik, and Peng He, “A Study on Transmission properties of AuNi coated polymer ball joint and Sn58Bi solder joint for flex-on-board interconnection,” Journal of Advanced Joining Processes, Volume 5, 2022, 100099, ISSN 2666-3309.
[19] *Daehwan Lho, Hyunwook Park, Shinyoung Park, Subin Kim, Hyungmin Kang, Boogyo Sim, Seongguk Kim, Junyong Park, Kyungjun Cho, Jinwook Song, Youngwoo Kim, and Joungho Kim, "Channel Characteristic-Based Deep Neural Network Models for Accurate Eye Diagram Estimation in High Bandwidth Memory (HBM) Silicon Interposer," in IEEE Transactions on Electromagnetic Compatibility, vol. 64, no. 1, pp. 196-208, Feb. 2022.
[18] *Gapyeol Park, Youngwoo Kim, Kyungjun Cho, Junyong Park, Insu Hwang, Jihye Kim, Kyungjune Son, Hyunwook Park, Atom O. Watanabe, Pulugurtha M. Raj, Rao R. Tummala, and Joungho Kim, "Measurement and Analysis of Through Glass Via Noise Coupling and Shielding Structures in a Glass Interposer," in IEEE Transactions on Electromagnetic Compatibility, vol. 63, no. 5, pp. 1562-1573, Oct. 2021.
[17] *Youngwoo Kim, Junyong Park, Joungho Kim, and Yo-Ichi Hayashi, "Statistical Eye-Diagram Estimation Method Considering Power/Ground Noise Induced by Simultaneous Switching Output (SSO) Buffers," in IEEE Transactions on Electromagnetic Compatibility, vol. 62, no. 6, pp. 2547-2557, Dec. 2020.
[16] *Kyungjune Son, Kyungjun Cho, Subin Kim, Shinyoung Park, Daniel H. Jung, Junyong Park, Gapyeol Park, Seongguk Kim, Taein Shin, Youngwoo Kim, and Joungho Kim, "Signal Integrity Design and Analysis of 3-D X-Point Memory Considering Crosstalk and IR Drop for Higher Performance Computing," in IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 10, no. 5, pp. 858-869, May 2020.
[15] *Hyunwook Park, Junyong Park, Subin Kim, Kyungjun Cho, Daehwan Lho, Seungtaek Jeong, Shinyoung Park, Gapyeol Park, Boogyo Sim, Seongguk Kim, Youngwoo Kim, and Joungho Kim”, “Deep Reinforcement Learning-based Optimal Decoupling Capacitor Design Method for Silicon Interposer-based 2.5-D/3-D ICs,” in IEEE Transactions on Components, Packaging and Manufacturing Technology, Oct, 2019.
[14] *Kyungjun Cho, Youngwoo Kim, Subin Kim, Hyunwook Park, Junyong Park, Seongsoo Lee, Daeyong Shim, Kangseol Lee, Sangmok Oh, and Joungho Kim, "Fast and Accurate Power Distribution Network Modeling of a Silicon Interposer for 2.5-D/3-D ICs With Multiarray TSVs," in IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 9, no. 9, pp. 1835-1846, Sept. 2019.
[13] *Junyong Park, and Joungho Kim, “Generator Polynomial Model-based Eye-diagram Estimation Method for Bose-Chaudhuri-Hocquenghem (BCH) Code and Reed-Solomon (RS) Code,” in IEEE Transactions on Electromagnetic Compatibility, Sept. 2018.
[12] *Seongsoo Lee, Dong-Hyun Kim, Yeonje Cho, Hongseok Kim, Chiuk Song, Seungtake Jeong, Jinwook Song, Gyeyoung Park, Seokwoo Hong, Junyong Park, Kyungjun Cho, Hyunsuk Lee, Chulhun Seo, Seungyoung Ahn, and Joungho Kim, "Low Leakage Electromagnetic Field Level and High Efficiency Using a Novel Hybrid Loop-array Design for Wireless High Power Transfer System," in IEEE Transactions on Industrial Electronics,, pp. 1-1, Jul. 2018.
[11] *Junyong Park, Shinyoung Park, Youngwoo Kim, Gapyeol Park, Hyunwook Park, Daehwan Lho, Kyungjun Cho, Seongsoo Lee, Dong-Hyun Kim, and Joungho Kim, “Polynomial Model-based Eye-Diagram Estimation Method for Pseudo-Random Binary Sequence (PRBS) and Scrambled Data,” in IEEE Transactions on Electromagnetic Compatibility, Jun. 2018.
[10] *Kyungjun Cho, Youngwoo Kim, Hyunsuk Lee, Jinwook Song, Junyong Park, Seongsoo Lee, Subin Kim, Gapyeol Park, Kyungjune Son, and Joungho Kim, "Signal Integrity Design and Analysis of Differential High-Speed Serial Links in Silicon Interposer With Through-Silicon Via," in IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. , no. , pp. 1-15, Jun. 2018.
[9] *Junyong Park, Daniel H. Jung, Byunggon Kim, Sumin Choi, Youngwoo Kim, Gapyeol Park, Kyungjun Cho, Seongsoo Lee, and Joungho Kim, “ A Novel Eye-diagram Estimation Method for Pulse Amplitude Modulation with N-Level (PAM-N) on Stacked Through-Silicon Vias (TSVs), " in IEEE Transactions on Electromagnetic Compatibility, vol. , no. , pp. 1-9, Jun. 2018.
[8] *Junyong Park, Hyesoo Kim, Jonghoon J. Kim, Dong-Hyun Kim, Kyungjune Son, Subin Kim, Seongsoo Lee, Kyungjun Cho, Bumhee Bae, Dongho Ha, Michael Bae, and Joungho Kim, “High-frequency Electrical Characterization of a New Coaxial Silicone Rubber Socket for High-bandwidth and High-density Package Test,” in IEEE Transactions on Components, Packaging and Manufacturing Technology, vol., no., pp. 1-11, May. 2018.
[7] *Kyungjun Cho, Youngwoo Kim, Hyunsuk Lee, Heegon Kim, Sumin Choi, Subin Kim, Junyong Park, Seongsoo Lee, and Joungho Kim, “Signal Integrity Design and Analysis of Silicon Interposer for GPU-Memory Channels in High Bandwidth Memory (HBM) Interface,” in IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 8, no. 9, pp. 1658-1671, Jan. 2018.
[6] *Junyong Park, Sumin Choi, Jonghoon J. Kim, Youngwoo Kim, Manho Lee, Heegon Kim, Bumhee Bae, Huijin Song, Kyungjun Cho, Seongsoo Lee, Hyunsuk Lee, and Joungho Kim, "A Novel Stochastic Model-Based Eye-Diagram Estimation Method for 8B/10B and TMDS-Encoded High-Speed Channels," in IEEE Transactions on Electromagnetic Compatibility, vol. 60, no. 5, pp. 1510-1519, Nov. 2017.
[5] *Yeonje Cho, Seongsoo Lee, Dong-Hyun Kim, Hongseok Kim, Chiuk Song, Sunkyu Kong, Junyong Park, Culhun Seo, and Joungho Kim, "Thin Hybrid Metamaterial Slab With Negative and Zero Permeability for High Efficiency and Low Electromagnetic Field in Wireless Power Transfer Systems," in IEEE Transactions on Electromagnetic Compatibility, vol. 60, no. 4, pp. 1001-1009, Aug. 2018.
[4] *Youngwoo Kim, Jonghyun Cho, Kyungjun Cho, Junyong Park, Subin Kim, Dong-Hyun Kim, Gapyeol Park, Srikrishna Sitaraman, Pulugurtha Markondeya Raj, Rao R. Tummala, and Joungho Kim, "Glass-Interposer Electromagnetic Bandgap Structure With Defected Ground Plane for Broadband Suppression of Power/Ground Noise Coupling," in IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 7, no. 9, pp. 1493-1505, Sept. 2017.
[3] *Hyesoo Kim, Jonghoon J. Kim, Junyong Park, Shinyoung Park, Sumin Choi, Bumhee Bae, Dongho Ha, Michael Bae, and Joungho Kim, "High-Frequency Modeling and Signal Integrity Analysis of a Silicone Rubber Socket for High-Performance Package," in IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 7, no. 8, pp. 1356-1368, Aug. 2017.
[2] *Dong-Hyun Kim, Youngwoo Kim, Jonghyun Cho, Bumhee Bae, Junyong Park, Hyunsuk Lee, Jaemin Lim, Jonghoon J. Kim, Stefano Piersanti, Francesco de Paulis, Antonio Orlandi, and Joungho Kim, "Through-Silicon Via Capacitance–Voltage Hysteresis Modeling for 2.5-D and 3-D IC," in IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 7, no. 6, pp. 925-935, June 2017.
[1] *Jonghoon J. Kim, Heegon Kim, Daniel H. Jung, Sumin Choi, Jaemin Lim, Youngwoo Kim, Junyong Park, Hyesoo Kim, Dongho Ha, Michael Bae, and Joungho Kim, "Signal Integrity Design and Analysis of a Multilayer Test Interposer for LPDDR4 Memory Test With Silicone Rubber-Based Sheet Contact," in IEEE Transactions on Electromagnetic Compatibility, vol. 59, no. 4, pp. 1239-1251, Aug. 2017.
[32] Zhekun Peng, Junyong Park, Sathvika Bandi, Santosh Pappu, Srinivas Venkataraman, Xu Wang, Granthana Ranzaswamy, and DongHyun Kim, "Cascading of 2D and 3D Simulations of ASIC Substrate Interconnect up to 100 GHz," 2024 IEEE 33rd Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS), Toronto, ON, Canada, 2024, pp. 1-3, doi: 10.1109/EPEPS61853.2024.10754397.
[31] M. Mousavi, Kevin Cai, Junyong Park, Chaofeng Li, Manish Mathew, Reza Asadi, Shameem Ahmed, DongHyun Kim, and Bidyut Sen, "Impact of Non-Functional Pads Location on Eye Diagram Performance," 2024 IEEE 33rd Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS), Toronto, ON, Canada, 2024, pp. 1-3, doi: 10.1109/EPEPS61853.2024.10753991.
[30] Junyong Park, DongHyun (Bill) Kim, "Statistical Eye Diagram for Nonideal Decision Feedback Equalizer (DFE)," 2024 IEEE Joint International Symposium on Electromagnetic Compatibility, Signal & Power Integrity: EMC Japan / Asia-Pacific International Symposium on Electromagnetic Compatibility (EMC Japan/APEMC Okinawa), Ginowan, Okinawa, Japan, 2024.
[29] Junyong Park, Chaofeng Li, Eddie Mok, Joe Dickson, Joan Tourné, and DongHyun (Bill) Kim, “New Vertical Connection in PCB & its Scalable Model,” 2024 DesignCon, Santa Clara, CA, Jan. 2024.
[28] Chaofeng Li, Junyong Park, Eddie Mok, Joe Dickson, Joan Tourne, and DongHyun Kim, “Vertical Conductive Structure Technology: Simulation & Measurement,” 2024 DesignCon, Santa Clara, CA, Jan. 2024.
[27] DongHyun Kim, Siqi Bai, Junda Wang, Junyong Park, Bichen Chen, Xu Wang, Srinivas Venkataraman, and Jun Fan, “Analysis on Power Via Induced Quasi-quarter-wavelength Resonance to Reduce Crosstalk,” 2020 DesignCon, Santa Clara, CA, Jan. 2020.
[26] Junyong Park, Teain Shin, Seongguk Kim, Hyunwook Park, Daehwan Lho, Kyungjun Cho, Hyesoo Kim, Michael Bae, Dongho Ha, and Joungho Kim, "Electrical Performance Comparison between Coaxial and Non-coaxial Silicone Rubber Socket," 2019 Joint International Symposium on Electromagnetic Compatibility, Sapporo and Asia-Pacific International Symposium on Electromagnetic Compatibility (EMC Sapporo/APEMC), Sapporo, Japan, 2019, pp. 293-296.
[25] Junyong Park, Seongguk Kim, Taein Shin, Daehwan Lho, Hyunwook Park, Gapyeol Park, and Joungho Kim, "Eye Diagram Prediction for Input/output Buffer Information Specification-Algorithmic Modeling Interface (IBIS-AMI)," 2019 Joint International Symposium on Electromagnetic Compatibility, Sapporo and Asia-Pacific International Symposium on Electromagnetic Compatibility (EMC Sapporo/APEMC), Sapporo, Japan, 2019, pp. 297-300.
[24] Junyong Park, Youngwoo Kim, Kyungjun Cho, Seongsoo Lee, and Joungho Kim, "A Novel Eye Diagram Estimation Method for Pulse Amplitude Modulation with N Levels on Stacked Through Silicon Vias," 2018 Electromagnetic Compatibility Joint Workshop (EMCJ-WS), Daejeon, South Korea, pp.29.
[23] Subin Kim, Youngwoo Kim, Kyungjun Cho, Jinwook Song, Shinyoung Park, Junyong Park, Hyunwook Park, Seungtake Jeong, and Joungho Kim, "Design and Analysis of Interposer-Level Integrated Voltage Regulator for Power Noise Suppression in High Bandwidth Memory I/O Interface," 2018 IEEE 27th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS), San Jose, CA, USA, 2018, pp. 159-161.
[22] Daehwan Lho, Junyong Park, Hyunwook Park, Hyungmin Kang, Shinyoung Park, and Joungho Kim, "Eye-Width and Eye-Height Estimation Method Based on Artificial Neural Network (ANN) for USB 3.0," 2018 IEEE 27th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS), San Jose, CA, USA, 2018, pp. 209-211.
[21] Hyunwook Park, Junyong Park, Subing Kim, Daehwan Lho, Shinyoung Park, Gapyeol Park, Kyungjun Cho, and Joungho Kim, "Reinforcement Learning-Based Optimal on-Board Decoupling Capacitor Design Method," 2018 IEEE 27th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS), San Jose, CA, USA, 2018, pp. 213-215.
[20] Gapyeol Park, Youngwoo Kim, Kyungjun Cho, Junyong Park, Atom Watanabee, Pulugurtha MarkondeyaRaj, Venky Sundaram, Kyungjune Son, Hyunwook Park, Rao Tummala, and Joungho Kim, "Design and Analysis of Receiver Channels of Glass Interposers for 5G Small Cell Front End Module," 2018 IEEE 27th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS), San Jose, CA, USA, 2018, pp. 107-109.
[19] Shuye Zhang, Tiesong Lin, Peng He, Junyong Park, Gapyeol Park, Huijin Song, Joungho Kim, and Kyung-Wook Paek, "A Study on the High Frequency Performance of Solder ACFs Joints for Flex-on-Board Applications Using Coplanar Waveguide," 2018 IEEE 68th Electronic Components and Technology Conference (ECTC), San Diego, CA, 2018, pp. 2404-2409.
[18] Junyong Park, Huijin Song, Dong-Hyun Kim, Sumin Choi, and Joungho Kim, "Statistical eye-diagram estimation method for high-speed channel with N-tap decision feedback equalizer (DFE)," 2018 IEEE International Symposium on Electromagnetic Compatibility and 2018 IEEE Asia-Pacific Symposium on Electromagnetic Compatibility (EMC/APEMC), Suntec City, Singapore, 2018, pp. 1027-1032.
[17] Dong-Hyun Kim, Subin Kim, Junyong Park, Youngwoo Kim, Sumin Choi, Kyungjun Cho, and Joungho Kim, "Bias-dependent power distribution network impedance analysis with MOS capacitor," 2018 IEEE International Symposium on Electromagnetic Compatibility and 2018 IEEE Asia-Pacific Symposium on Electromagnetic Compatibility (EMC/APEMC), Suntec City, Singapore, 2018, pp. 40-40.
[16] Junyong Park, Dong-Hyun Kim, Youngwoo Kim, Sumin Choi and Joungho Kim, "Eye-diagram estimation with stochastic model for 8B/10B encoded high-speed channel," 2018 IEEE International Symposium on Electromagnetic Compatibility and 2018 IEEE Asia-Pacific Symposium on Electromagnetic Compatibility (EMC/APEMC), Suntec City, Singapore, 2018, pp. 1-5.
[15] Sumin Choi, Heegon Kim, Junyong Park, Dong-Hyun Kim, Daniel H. Jung, Jaemin Lim, Kyungjun Cho, and Joungho Kim, "Estimation and analysis of crosstalk effects in high-bandwidth memory channel," 2018 IEEE International Symposium on Electromagnetic Compatibility and 2018 IEEE Asia-Pacific Symposium on Electromagnetic Compatibility (EMC/APEMC), Suntec City, Singapore, 2018, pp. 4-4.
[14] Huijin Song, Jonghoon J. Kim, Junyong Park, Junho Lee and Seongmin Choi, and Joungho Kim, "Design and verification of a high-speed connector for multi-media system," 2017 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI), Washington, DC, USA, 2017, pp. 22-25.
[13] Huijin Song, Jonghoon J. Kim, Junyong Park, Junho Lee, Seongmin Choi, and Joungho Kim, "Signal Integrity Analysis of High Speed Connector for Multi-Media System," 2017 Asia-Pacific International Symposium on Electromagnetic Compatibility (APEMC), Seoul, 2017.
[12] Junyong Park, Jonghoon J. Kim, Sumin Choi, Youngwoo Kim, Heegon Kim, and Joungho Kim, "Eye-Diagram Estimation Methods for Voltage-and Probability-Dependent PAM-4 Signal on Stacked Through-Silicon Vias (TSVs)," 2017 IEEE 67th Electronic Components and Technology Conference (ECTC), Orlando, FL, 2017, pp. 1724-1731.
[11] Sumin Choi, Heegon Kim, Kiyeong Kim, Junyong Park, Daniel H. Jung, and Joungho Kim, "Signal Integrity Analysis of Silicon/Glass/Organic Interposers for 2.5D/3D Interconnects," 2017 IEEE 67th Electronic Components and Technology Conference (ECTC), Orlando, FL, 2017, pp. 2139-2144.
[10] Hyesoo Kim, Junyong Park, Shinyoung Park, Jonghoon J. Kim, Dongho Ha, Michael Bae, Jongcheon Shin and Joungho Kim, "High-frequency modeling and signal integrity analysis of high-density silicone rubber socket," 2016 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS), Honolulu, HI, 2016, pp. 55-57.
[9] Junyong Park, Jonghoon J. Kim, Heegon Kim, Michael Bae, Dongho Ha, and Joungho Kim, "Eye diagram estimation of 8B/10B encoded high-speed serial link for signal integrity test using silicone rubber socket", 2016 IEEE International Symposium on Electromagnetic Compatibility (EMC), Ottawa, ON, pp. 467-471, 2016.
[8] Jonghoon J. Kim, Heegon Kim, Daniel H. Jung, Sumin Choi, Jaemin Lim, Junyong Park, Jiseong Kim, Dongho Ha, Michael Bae, and Joungho Kim, "Design and analysis of silicone rubber-based TERAPOSER for LPDDR4 memory test," 2016 IEEE International Symposium on Electromagnetic Compatibility (EMC), Ottawa, ON, pp. 450-454, 2016
[7] Junyong Park, Hyesoo Kim, Jonghoon J. Kim, Bumhee Bae, Dongho Ha, Michael Bae, and Joungho Kim, "Measurement of High-Bandwidth and High-Density Silicone Rubber Socket up to 110GHz", 2016 IEEE 66th Electronic Components and Technology Conference (ECTC), Las Vegas, NV, pp. 2481-2486, Jun. 2016.
[6] Jonghoon J. Kim, Junyong Park, Heegon Kim, Bumhee Bae, Daniel H. Jung, Dongho Ha, Michael Bae, and Joungho Kim, "Design and Analysis of Silicon Rubber-based TERAPOSER for LPDDR4 Memory Test", 2016 DesignCon, Santa Clara, CA, Jan. 2016.
[5] Bumhee Bae, Junyong Park, and Joungho Kim, "Design of Active Connector for High Speed Serial Link Interconnection", Electrical Design of Advanced Packaging and Systems Symposium (EDAPS), 2015 IEEE, vol., no., pp.163-165, Dec. 2015.
[4] Junyong Park, Hyesoo Kim, Youngwoo Kim, Jonghoon J. Kim, Bumhee Bae, Dongho Ha, Michael Bae, and Joungho Kim, "Analysis of External Force Dependent Lumped RLGC Model of High-Bandwidth and High-Density Silicone Rubber Socket", Electrical Design of Advanced Packaging and Systems Symposium (EDAPS), 2015 IEEE, vol., no., pp.54-57, Dec. 2015
[3] Hyesoo Kim, Bumhee Bae, Jonghoon J. Kim, Junyong Park, Dongho Ha, Michael Bae, and Joungho Kim, "Modeling and Analysis of a Conductive Rubber Contactor for Package Test", 2015 Electronics Packaging Technology Conference (EPTC), Dec. 2015
[2] Junyong Park, Hyesoo Kim, Jonghoon J. Kim, Bumhee Bae, Michael Bae, Dongho Ha and, Joungho Kim, "Eye Diagram Estimation on Silicone Rubber Socket", Korea-Japan Joint Conference (KJJC-2015) on EMT/EMC/BE, 2015 8th, vol., no., 35, pp. 23-24, Nov. 2015
[1] Junyong Park, Hyesoo Kim, Jonghoon J. Kim, Hyosup won, Bumhee Bae, Michael Bae, Dongho Ha, and Joungho Kim, "Modeling and measurement of high-bandwidth and high-density silicone rubber socket for 100Gbps transceiver IC test", Electrical Performance of Electronic Packaging and Systems (EPEPS), 2015 IEEE 24th, vol., no., pp.109-112, 25-28 Oct. 2015