1) Thermal Management and Mechanical Warpage Control in Advanced Semiconductor Packaging 
As advanced semiconductor packaging technologies such as 2.5D/3D integration and heterogeneous die stacking continue to scale, thermal management and mechanical warpage have emerged as key reliability challenges. High power density and multilayer stacking cause heat accumulation and thermally induced stress, which degrade interconnect integrity, bonding reliability, and overall package performance. Our laboratory focuses on the precise control of thermo-mechanical behavior in advanced semiconductor packaging. We investigate critical unit processes—including electroplating, CMP, and TSV formation for hybrid bonding and heterogeneous die integration—and systematically analyze their impact on heat transfer and mechanical warpage. Through ANSYS-based multiphysics simulations, we optimize package design and fabrication processes to achieve enhanced thermal performance and mechanical reliability.

2) Nanoelectromechanical Switch and Memory for Harsh Environments (radiation & extreme temperatures)

With the explosive growth of the Internet of Things (IoT), artificial intelligence (AI), and big data, the integration of these technologies is expanding into diverse sectors. While initially applied in emerging transportation solutions like autonomous vehicles and urban air mobility (UAM), their reach now extends to critical industries such as space exploration, nuclear energy, and avionics systems. These applications area demand electronic devices capable of maintaining exceptional stability under harsh environmental conditions. However, traditional CMOS devices face significant challenges in such environments, including increased leakage current, reduced refresh, and shifts in threshold voltage.

Nanoelectromechanical (NEM) switch and memory offer a promising alternative due to their mechanical operation mechanism, which provides robust resilience against high-energy radiation and extreme temperatures. Our research aims to leverage advanced semiconductor fabrication techniques to develop reliable NEM devices and explore their potential for widespread applications in space, nuclear, and avionics systems.

3) Highly reliable Microelectromechanical Switch, Circuit, and Components for Quantum Computer 

Quantum computers are generally composed of three primary components: qubits (the quantum substrate), a control processor, and a memory block. Qubits, the fundamental units of quantum information, are extremely sensitive to environmental noise and thus need to be placed at millikelvin temperatures. In current lab-scale quantum systems, a conventional computer at room temperature controls the qubits, with control signals transmitted through long cables. While this setup works for a small number of qubits, it becomes impractical when trying to scale up to millions of qubits due to the complexity and sheer volume of wiring required to connect the room-temperature electronics to the cryogenic qubits. Therefore, to enable large-scale quantum computers, it's crucial to develop electronics that can reliably operate at the cryogenic temperatures.

Microelectromechanical (MEM) switches can be designed to operate at extremely low temperatures through mechanical/material engineering. Furthermore, the MEM switch can exhibit low on-resistance and low signal distortion through metal-to-metal contact, making them strong candidates for integration into quantum computing systems. Our goal is to develop highly reliable cryogenic  MEM switches, circuit, and components, paving the way for their use in quantum computers.