Journal Papers

Tae-Soo Kim, Yong-Bok Lee, So-Young Lee, Sung-Ho Kim, and Jun-Bo Yoon. "Highly Selective Etching of Silicon Dioxide over Aluminum using Mixtures of Sulfuric Acid and Hydrofluoric Acid"
Journal of Microelectromechanical Systems (2024)

Yong-Bok Lee, Pan-Kyu Choi, Min-Ho Kang, Su-Hyun Kim, Seung-Jun Lee, Tae-Soo Kim, So-Young Lee, and Jun-Bo Yoon. "Wafer-Scale CMOS-Compatible Electro-Thermally Actuated Nanomechanical Non-Volatile Switch with Out-of-Plane Electrode Configuration"
Advanced Electronic Materials 2400045 (2024)

Yong-Bok Lee, Min-Ho Kang, Pan-Ku Choi, Su-Hyun Kim, Tae-Soo Kim, So-Young Lee, and Jun-Bo Yoon. "Sub-10 fJ/bit Radiation-hard Nanoelectromechanical Non-volatile Memory"
Nature communications 14(1), 460 (2023) (selected as Editor’s highlights) 

Su-Hyun Kim†, Pan-Kyu Choi†, Yong-Bok Lee, Tae-Soo Kim, Min-Seung Jo, So-Young Lee, Hyun-Woo Min, and Jun-Bo Yoon (†equally contributed) "An experimental and numerical study on adhesion force at the nanoscale" Nanoscale Advances  6(8), 2013-2025  (2023)

Tae-Soo Kim, Yong-Bok Lee, Sung-Ho Kim, So-Young Lee, Seung-Jun Lee, and Jun-Bo Yoon. "Monolithically 3-D Integrated Nanoelectromechanical (NEM) Configuration Memory for CMOS-NEM Hybrid Demultiplexer"
IEEE Electron Device Letters 44(12), 2055 - 2058  (2023)

Su-Bon Kim†, Hyun-Woo Min†, Yong-Bok Lee, Su-Hyun Kim, Pan-Kyu Choi and Jun-Bo Yoon. (†equally contributed) "Utilizing Mechanical Adhesion Force as a High Contact Force in a MEMS Relay"
Sensors and Actuators A: Physical ​331, 112894 (2021)

Eunhwan Jo†,Yong-Bok Lee†, Yohan Jung, Su-Bon Kim, Yunsung  Kang, Min-Ho Seo, Jun-Bo Yoon, Jongbaeg Kim (†equally contributed) "Integration of Gold Nanoparticle–Carbon Nanotube Composite for Enhanced Contact Lifetime of Microelectromechanical Switches with Very Low Contact Resistance"
ACS Applied Materials & Interfaces 13(14), 16959-16967 (2021)

Su-Bon Kim, Yong-Hoon Yoon, Yong-Bok Lee, Kwang-Wook Choi, Min-Seung Jo, Hyun-Woo Min and Jun-Bo Yoon. "4 W Power MEMS Relay with Extremely Low Contact Resistance: Theoretical Analysis, Design and Demonstration"
Journal of Microelectromechanical Systems 29(5), 1304-1313 (2020)