Academic Editor (Associate Editor) (SCIE Journals):
(1) Associate Editor: IEEE Internet things Journal (IoTJ)
(2) Associate Editor: Telecommunication Systems Springer
(3) Associate Editor: Scientific Reports
(4) Technical Committee Member (Computer Communications Journal Elsevier)
Guest Editor
IEEE Journal of Biomedical and health informatics (SCIE, Q1)Link for submission: https://www.embs.org/jbhi/wp-content/uploads/sites/18/2025/01/JBHI_Trustworthy_LLM_HealthCare_SI_Call-for-papers-1.pdfSensors, (SCIE)
Please check link for submission and checking deadline
Computers, Materials and Continua, (SCI)
(IV) Lead Guest Editor: Computers, Materials and Continua, (SCIE, IF=3.7), 2022/2023
(V) Lead Guest Editor: Computers, Materials and Continua, (SCIE, IF=3.7), 2022/2023
Deadline for submission: 30 May 2023 (Open for Submissions)
Note: Accepted papers will be published as soon as the papers are accepted.
(VI) Guest Editor: Intelligent Automation and Soft Computing, (SCIE), 2022/2023
Deadline for submission: 9 March 2023 (Open for Submissions)
(III) Lead Guest Editor: Electronics MDPI, (SCIE, Impact Factor=2.690, Citescore=3.7), According to JCR 2022
Deadline for submission: June 2022
(2) Topic Editor: Electronics MDPI, (SCIE), 2021
Referee (SCIE, Peer Reviewed Journals):
- IEEE Transactions on Industrial Informatics
IEEE Transactions on Network Services and Management.
IEEE Internet of Things
IEEE Systems Journal
IEEE Sensors Journal
IEEE Communication Letters
IEEE IOT Magazine
IEEE Transactions on Intelligent Transportation Systems
TPC Member/Session Chair International Conferences:
(1) Track and Session Chair IEEE AEIoT 2025, Osaka, Japan
(3) Session Chair ICUFN 2021, Jeju South Korea (Program Link)
(4) Program Committee (Session Chair) ICNGC 2021 (Link)
(5) ICTC 2021, Jeju South Korea (TPC Member)
(6) GECOST 2021 , Malaysia Curtin university (TPC Member)
(7) Publication Chair GreenNet conference South Korea