Academic Editor (Associate Editor) (SCIE Journals):

(1) Associate Editor: IEEE Internet things Journal (IoTJ)

(2) Associate Editor: Telecommunication Systems Springer 

(3) Associate Editor: Scientific Reports

(4) Technical Committee Member (Computer Communications Journal Elsevier)

Guest Editor 

IEEE Journal of Biomedical and health informatics  (SCIE, Q1)Link for submission: https://www.embs.org/jbhi/wp-content/uploads/sites/18/2025/01/JBHI_Trustworthy_LLM_HealthCare_SI_Call-for-papers-1.pdf

Sensors, (SCIE)

Please check link for submission and checking deadline

Computers, Materials and Continua, (SCI)

(IV) Lead Guest Editor: Computers, Materials and Continua, (SCIE, IF=3.7), 2022/2023

(V) Lead Guest Editor: Computers, Materials and Continua, (SCIE, IF=3.7), 2022/2023

Deadline for submission: 30 May 2023 (Open for Submissions)

Note: Accepted papers will be published as soon as the papers are accepted.

(VI) Guest Editor: Intelligent Automation and Soft Computing, (SCIE), 2022/2023

Deadline for submission: 9 March 2023 (Open for Submissions)

(III) Lead Guest Editor: Electronics MDPI, (SCIE, Impact Factor=2.690, Citescore=3.7), According to JCR 2022

Deadline for submission: June 2022

(2) Topic Editor: Electronics MDPI, (SCIE), 2021

Referee (SCIE, Peer Reviewed Journals): 

TPC Member/Session Chair International Conferences:

(1) Track and Session Chair IEEE AEIoT 2025, Osaka, Japan

(3) Session Chair ICUFN 2021, Jeju South Korea (Program Link)

(4) Program Committee (Session Chair) ICNGC 2021 (Link)

(5) ICTC 2021, Jeju South Korea (TPC Member)

(6) GECOST 2021  , Malaysia Curtin university (TPC Member)

(7) Publication Chair GreenNet conference South Korea