Awards
Innovation in Education Awards, Provost's Advisory Council on Instructional Excellence (ACIE), Apr. 2023, I. Lee, "New Experiential, Discipline-based, and Technology-enhanced Lab Activities for Semiconductor Chip Design Courses"
Best Poster Presentation, ROK-USA Forum on Nanotechnology, April 2023, I. Lee, “Millimeter-Scale Smart Sensing Semiconductor Devices for Next-Generation IoT Applications”
Best Paper Award, ACM 27th Annual International Conference on Mobile Computing Nettworking (MobiCom'21), March 2022: I. Lee*, R. Hsiao*, Gordy Carichner, C.-W. Hsu, M. Wang, S. Shoouri, K. Ernst, T. Carichner, Y. Li, J. Lim, C. R. Julick. E. Moon, Y. Sun, J. Phillips, K. L. Montooth, D. A. Green II, H.-S. Kim, and D. Blaauw, "mSAIL: Milligram-Scale Multi-Modal Sensor Platform for Monarch Butterfly Migration Tracking" (* equally contributed)
Winner, WIMS2 2015 IAB Poster Contest, University of Michigan, October 2015: W. Lim, I. Lee, D. Sylvester, and D. Blaauw, “Batteryless Sub-nW Cortex-M0+ Processor with Dynamic Leakage-Suppression Logic”
Bronze Prize, Human-Tech Thesis Prize, Samsung Electronics, February 2014: Y. Kim, W. Jeong, and I. Lee, “A Static Contention-Free Single-phase-Clocked 24T Flip-Flop in 45nm for Low-Power Applications”
Silver Prize, Human-Tech Thesis Prize, Samsung Electronics, February 2012: Y. Lee, I. Lee, Y. Kim, S. Bang, and G. Kim, “A Modular 1mm3 Die-Stacked Sensing Platform”
Best Student Poster Award, Multiscale Systems Center Annual Review, Multiscale Systems Center, November 2011: Y. Lee, G. Kim, S. Bang, Y. Kim, I. Lee, D. Sylvester, and D. Blaauw, “A Modular 1mm3 Die-Stacked Sensing Platform”
Bronze Prize, Semiconductor Chip Design Contest, Korea intellectual Property Office, November 2007: Y. Chae, I. Lee, and G. Han, “Low-Power Audio ΔΣ Analog-to-Digital Converter”
Best New Student Scholarships, Yonsei University, South Korea, September 2006
Highest Honors at Graduation, Yonsei University, South Korea, August 2006