Wearable Electronic Materials and Devices
- Polymer Electrolyte Composite
- Electronic Devices
- Wearable Strain Sensor
- Tough Self-Healing Materials
- Functional Gels
Semiconductor Packaging Materials
- Thermally Conductive Epoxy
(반도체 패키징용 에폭시 방열 소재 개발)
Ion gels are polymer electrolyte composites (PECs) based on ionic liquids (ILs) and supporting network structures.
ILs are organic ions characterized by weak intermolecular interactions and structural asymmetries. These features reduce their tendency of crystallization, thus resulting in their low melting temperatures and high ionic conductivities at room temperature.
PECs provide a versatile platform for wearable devices, wherein the electrical, physicochemical, and mechanical properties of the composites can be modulated depending on the IL selection and network-forming methodologies.
Recently, more than one cross-linking mechanism has been incorporated to realize double network structures with enhanced mechanical properties.
ACS Appl. Polym. Mater. 2022, 4, 5821−5830
Solidified ionic liquid-based composite electrolytes, also known as ion gels, have recently attracted much interest because they possess outstanding benefits of ionic liquids such as ionic mobility, specific capacitance, chemical and electrochemical stability, and negligible vapor pressure in a solid form.
These characteristics of the gel electrolytes allow them to be considered as attractive candidates for many applications in energy conversion/storage devices, actuators, electrochromic/ light-emitting displays, and printed electronics.
ACS Appl. Mater. Interfaces 2017, 9, 8813−8818
The stretchable skin-type strain sensors were attached to various body joints (wrist and finger) and employed to detect human motion.
The change in the relative resistance (ΔR/R0) across the specimen was monitored as tensile strains incurred by human motion were applied and released repeatedly.
The behaviors of the undamaged and self-healed samples are not distinguishable, implying that the functionality recovery is accompanied by the restoration of the mechanical properties.
The magnitude of the strain imposed on the device was controlled using a motorized stage, and the strain sensor was operated under small mechanical deformations.
ACS Appl. Polym. Mater. 2022, 4, 5821−5830
The composites are characterized by both IL-phobic association and crystallization. The resultant distribution of the bonding strength can result in tough networks.
Depending on their crystallinity, the composites exhibited varying degrees of self-healing capabilities at room temperature without any external trigger (e.g., light, heat, or solvents)
Composites also exhibited the maximal mechanical behavior, which surpassed that of previously reported room temperature self-healable PECs by orders of magnitude. The PEC was ionically conductive and was employed to fabricate self-healable strain sensors capable of monitoring human motion.
ACS Appl. Polym. Mater. 2022, 4, 5821−5830
Ionogel-based Actuators
Ionogel-based Triboelectric Nanogenerators(TENGs)
⏹ 에폭시 물성 개선용 첨가제 개발 ⏹ 방열용 정렬구조 형성 재료 개발
칩은 상호 연결을 위해 패키징에 의존하여 전원 공급, 신호 교환 및 전반적인 기능을 구현합니다. 반도체 제품의 속도, 밀도, 기능은 끊임없이 변화하고 발전하는 상호 연결 방식에 따라 진화합니다. 5G, 자율주행차, 사물 인터넷(IoT) 기술, 가상 및 증강 현실의 등장으로 고성능 반도체가 더욱 중요해지고 있습니다.
방대한 양의 데이터를 빠르게 처리할 수 있는 고성능의 에너지 효율적인 칩에 대한 수요가 증가하고 있습니다. 새로운 애플리케이션이 주류로 부상하면서 이를 구동하는 반도체에 대한 수요 증가를 충족하기 위해 첨단 패키징이 중요한 시점입니다.
삼성전자와 마이크론 테크놀로지에서는 TC-NCF (Thermo-Compression Non-Conductive Film) 방식으로 HBM을 제작하고 있습니다.
NCF라는 필름을 사용하여 열과 압력을 사용하는 방식으로, D램들을 수직으로 적층하는데 사용되고 있습니다.
반도체 패키징의 중요성이 더욱 커지면서 반도체 기업들은 패키징 관련 사업을 확대하고 있습니다.
예를 들어, 삼성 전자의 경우 2027년까지 천안에 HBM 첨단 패키징 설비 구축에 투자하였으며, 중국, 일본과도 협력 중에 있습니다.