E-mail: 22201657@inha.edu
Postdoctoral Researcher @ Inha Univ.
Joined at Mar. 2026
B.S. Chemical Engineering & Technology
@Yanbian Univ.
Ph.D. Environmental & Polymer Engineering @Inha Univ.
🔶 Research area
Packaging Materials
Electrorheology
Magnetorheology
E-mail: 94minjun@naver.com
Ph.D. student @ Inha Univ.
Joined at Mar. 2021
B.S. Polymer Science & Engineering @Inha Univ.
M.S. Environmental & Polymer Engineering @ Inha Univ.
🔶 Research area
Dual Cross-linked Polymer Electrolyte Composites
Actuators
Packaging Materials
E-mail: gn99696@gmail.com
M.S Student @ Inha Univ.
Joined at Mar. 2025
B.S. Polymer Science & Engineering
@Korea National Univ. of Transportation
🔶 Research area
Packaging Materials
Polymer Thin film
Physically Unclonable Functions(PUFs)
E-mail: wjdangur00@naver.com
M.S Student @ Inha Univ.
Joined at Mar. 2025
B.S. Polymer Science & Engineering @Inha Univ.
Current 두산전자 연구소 산학장학생
🔶 Research area
Hydrogen Bonding Functional Gels
Strain Sensors
Self-Healing Materials
Packaging Materials
E-mail: jusi1512@gmail.com
M.S Student @ Inha Univ.
Joined at Sep. 2025
B.S. Polymer Science & Engineering @Inha Univ.
🔶 Research area
Packaging Materials
E-mail: wpueg@naver.com
M.S Student @ Inha Univ.
Joined at Mar. 2026
B.S. Polymer Science & Engineering @Inha Univ.
🔶 Research area
Packaging Materials
Polymer Thin film
Physically Unclonable Functions(PUFs)
E-mail: jaemmu1207@naver.com
M.S Student @ Inha Univ.
Joined at Mar. 2026
B.S. Polymer Science & Engineering @Inha Univ.
🔶 Research area
Hydrogen Bonding Functional Gels
Strain Sensors
Self-Healing Materials
Packaging Materials
<반도체 후공정용 에폭시 소재 설계 및 분석 / Design and analysis of epoxy materials for semiconductor post-processing>