Speakers

Dr. Hemant Darbari (Mission Director, National Supercomputing Mission)


Dr. Hemant Darbari 

(Mission Director, National Supercomputing Mission)


Abstract:

Main thrust in the National Supercomputing Mission (NSM) is to provide the Supercomputing Infrastructure of varying compute capacities to the Academia, Researchers, MSMEs and Start-ups for meeting their compute needs and to create the capability of Design and Manufacturing of the Supercomputers indigenously in India, under the Make-in-India initiative of the Government of India. C-DAC has been entrusted with the responsibility to design, develop, and deploy Supercomputing systems under NSM.

 

As part of NSM, C-DAC has built indigenous Supercomputing ecosystem in a phased manner, which has led to indigenously designed and manufactured Supercomputers. Now in NSM 2.0 we have planned  to establish Pre-exa/Exa-Scale Supercomputing eco-system comprising of HPC Microprocessors; HPC Servers with Multiple Architectures; High Speed Network  Interconnects; Storage Systems; System Software Stack, HPC Systems and even integration of HPC with Quantum Accelerators. It is envisaged to facilitate solving Grand Challenge problems with the thus developed ecosystem.

 

About the Speaker:

Dr Hemant Darbari is the Mission Director of the National Super Computing Mission in India. He is an alumnus of IIT-Roorkee & University of Allahabad. He is a founding member of the Centre for Development of Advanced Computing (C-DAC) and before taking over the current assignment he was the Director General of C-DAC. He has as vast experience of more than three decades in the areas of Artificial Intelligence, Machine Translation, and High Performance Computing (HPC). As a Director General, C-DAC he was responsible for building capacity and capability for R&D in the multi-specialty domains of HPC, Multilingual Computing, Software Technologies, Health Informatics, Disaster management, e-Governance and Education & Training. He has also designed, developed, and executed very large projects of National Importance.

 

He is recipient of the prestigious "Computerworld Smithsonian Award Medal" for his work on MANTRA-: A Machine assisted Translation tool and "VASVIK Award" for his contributions to the advancement of Information and Communication Technologies. He has also received the "Award of Excellence in Corporate Leadership" at IIPS-2015 and the "Vishwa Hindi Samman" for his contribution in the field of Hindi Language Computing, Research, and Development.

Ravinder DAHIYA

Bendable Electronics and Sustainable Technologies (BEST) Group

Northeastern University, Boston, MA 02115, USA

 High-Performance Printed Electronics


The advances in silicon-based micro/nanoelectronics have revolutionized society through fast computing and communication. This has mainly come through the miniaturization of devices on planar and stiff substrates and has greatly served the needs of almost every socio-economic sector. However, miniaturization-based approach alone is insufficient as several emerging applications (e.g., interactive systems, wearables, flexible displays etc.) require electronics with new features such as flexible form factors and seamless integration of devices onto soft materials. The environmental impact of inherently wasteful fabrication steps needed in conventional micro/nanofabrication are also of increasing concern. The applications and fabrication related challenges altogether call for new resource-efficient methods to realize high-performance electronics on unconventional flexible and stretchable substrates. This talk will present recent advances in this direction. In particular, the talk will focus on approaches such as hybrid integration of the off-the-shelf devices on soft substrates, ultra-thin chips for system in foil, and high-mobility semiconducting nanostructures-based printed electronics. The innovative resource efficient methods such as transfer printing, contact printing and direct-roll transfer printing etc. are expected to revolutionise the way electronic circuits will be manufactured in future and thus will open many new opportunities for semiconductor industry, in addition to triggering transformation in emerging fields such as robotics, wearables, and healthcare technologies.





Bio-Sketch

 

Ravinder Dahiya is Professor in the Department Electrical and Computer Engineering at Northeastern University, Boston, USA, where he leads the Bendable Electronics and Sustainable Technologies (BEST) group. His group conducts research in flexible printed electronics, electronic skin, and their applications in robotics, prosthetics, wearables, and interactive systems. He has authored or co-authored more than 500 publications, books and submitted/granted patents and disclosures. He has led or contributed to many international projects.

 

Prof. Dahiya is the President of IEEE Sensors Council and elected to serve on IEEE Board of Directors (2025-26). He is the Editor-in-Chief (EiC) of NPJ Flexible Electronics. He launched the IEEE Journal on Flexible Electronics and served as its Founding EiC and also served on the editorial boards of several other leading journals. He founded the IEEE International Conference on Flexible, Printed Sensors and Systems (FLEPS) and served as its General Chair or Technical Programme Chair, as well as that of other leading international conferences. Such as IEEE Sensors He is recipient of EPSRC Fellowship, Marie Curie Fellowship and Japanese Monbusho Fellowship and has received several awards, including Technical Achievement award from IEEE Sensors Council, Young Investigator Award from Elsevier, and 13 best journal/conference paper awards as author/co-author. He is Fellow of IEEE and the Royal Society of Edinburgh.

 

Web: www.rsdahiya.com