Conferences

4. Yehyun Shin, Ikkyum Kim, Minho Park, Junghyun Yoon, Seunghun Baek, Seongmin Eum, Heesoo Yang, Yurim Choi, Jaeyong Jeong, Sanhyun Kim, Haksoon Jung, Seongju Kim*, Heechun Park, and Jimin Kwon, "Active BSCDN Benchmark Framework with Backsdie-Compatible CNFET Logic Technology", 71st International Electron Devices Meeting (IEDM), 2025.

3. Jaeyong Jeong, Yurim Choi, Seongju Kim, Hyeongjun Kim, Jimin Kwon, and Sanhyeon Kim, "Monolithic 3D Integration of Ⅲ-Ⅴ HEMTs on Glass Using Ultra-Thin Dielectric Bonding Layer: A High-Frequency and Low-Loss Active Glass Platform for Sub-THz Applications", 71st International Electron Devices Meeting (IEDM), 2025.

2. Haksoon Jung, Nahyeon Kim, Yurim Choi, Seongju Kim, Hyunjin Park, Yunsik Park, Seungjun Chung, Jiheong Kang, Jimin Kwon, "3D Printed Fanout Interposer Substrates with Curved Through-Holes for Rapid Prototyping of Advanced Packaging", Electronics Components and Technology Conference (ECTC), 2025.

1. Nahyeun Kim, Haksoon Jung, Yurim Choi, Hyeongjun Kim, Seongju Kim, Yongwoo Lee, Yunsik Park, Seungyeon Koh, Hyeok Kim, Jimin Kwon, "Quasi-Coaxial Through-Hole Integrated Additively Manufactured Antenna-in-Package Lid Substrates", Electronics Components and Technology Conference (ECTC), 2025.