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Accepted papers will be submitted for inclusion into IEEE Xplore subject to meeting IEEE Xplore’s scope and quality requirements.
The first edition of the International Conference on Communication, Computing, Smart Materials and Devices is scheduled be held during 19th and 20th December, 2024. The theme of the conference is “Facilitating Future Technological Growth”
This conference aims to bring together experts from around the world to deliver papers and spark conversations about current advancements and trends in computing. The conference will include keynote speeches, thought-provoking talks, and a variety of presentations on the most recent research activity.
All submissions must be unique, unpublished, and not be in the process of being published while they are being assessed for this conference.
The conference website has complete information about author criteria and submission procedures.
Only papers that have been presented will be published.
The use of hybrid mode at ICCCSMD is limited to authors from outside India.
Authors from India are encouraged to present in person at the conference.
The conference will accept paper submissions in four tracks as listed below.
Track 1 Communication Engineering
Advanced Communication Networks
5G/6G and beyond
Industrial IoT Applications
Low Power IoT Devices/Systems
Mobile and Wearable Applications
Antennas, Propagation and Computational EM
RF/Millimeter-wave Circuits and Systems
THz, mmWave, and RF Systems for Communications
Materials and Structures
Microwave Metrology
RF and Microwaves in Medicine and Biology
Underwater Communication
Track 2 Computing
Artificial Intelligence (AI) in advanced networking
Big Data Cloud/Fog/Edge Computing, IoT, Industry 4.0 and beyond
AI/Machine Learning (ML) in computer vision applications
Safety, security, Cyberattacks and Cybersecurity
Reinforcement Learning (RL) and Deep Reinforcement Learning (DRL)
AV/UAV in Agriculture, Transportation and Smart city applications
Software defined networking and wireless sensors network
Green Computing and communications
Security and Ethical Concerns in AI
Quantum and post quantum cryptography
Track 3 Smart Materials
Materials Science and Engineering
Materials Properties, Measuring Methods and Applications
Development and Characterization of Multifunctional Materials
Bio-inspired Smart Materials and Systems
Materials for Structural Health Monitoring
Biomaterials
Additive Manufacturing and Rapid Prototyping
Materials for Electronics
Nanomaterials and Bionanomaterials
Track 4 Devices
Advanced CMOS Platforms, Interconnect and Backside Power Delivery Network (BSPDN) Technologies
Advanced Packaging, Chiplet and Heterogeneous Integration Technologies Including 2.5D and 3D
Analog and Mixed-Signal Circuits
Biomedical Systems & Biomedical Instrumentation
Biosensors
Data Converters
Device Physics, Characterization, Modeling and Reliability
Digital Circuits, Hardware Security, Signal Integrity, IOs
DTCO and Design Enablement
Frequency Generation and Clocking Circuits
Memory Technologies, Devices, Circuits, and Architectures
Power Management Devices and Circuits
Processes and Materials for CMOS Scaling and New Devices
Processors and SoCs
Fluid Cell Devices
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