Interview Preparation Program: DDR, USB, PCIe & High-Speed Layout Design

Course Duration: 4 Weeks
Mode: Online / Hybrid
Level: Intermediate to Advanced

Designed For: Working professionals in PCB design, hardware engineering, signal integrity, or board-level design roles

Why This Course?

This course is designed to help working professionals prepare for technical interviews in high-speed board design roles. It focuses on practical concepts, layout considerations, and real-world challenges in DDR, USB, and PCIe interface designs. You’ll gain confidence in both technical understanding and problem-solving strategies commonly evaluated in interviews.

Course Highlights

✅ Focused on real-world interview questions
✅ Deep dive into DDR, USB, PCIe design and SI-aware layout practices
✅ Covers schematic review, layout challenges, simulation checkpoints, and debug tips
✅ Includes mock interview scenarios and hands-on design review practice
✅ Designed and taught by industry experts

Course Modules

MODULE 1: DDR Layout Interview Preparation

• DDR Types: DDR3, DDR4, LPDDR4 – Basics & Differences
  
  

• Key DDR Layout Guidelines
  
  

  • Length Matching (DQS, DQ, ADDR/CMD/CLK)
    
    

  • Fly-by Topology vs T-Topology
    
    

  • Termination Techniques (ODT, external)
    
    

• Signal Integrity Considerations
  
  

  • Crosstalk and Impedance Control
    
    

  • Timing Budget and Setup/Hold Margins
    
    

• Common Interview Questions and Design Scenarios
  
  

• Debug/Validation Discussion (Eye Diagram, Margin Test)
  
  

MODULE 2: USB & PCIe Layout Interview Preparation

• USB Standards: USB 2.0, 3.0, 3.2 – Routing and Design Rules
  
  

• PCIe Versions and Lane Structure (Gen1 to Gen5)
  
  

• Differential Pair Routing
  
  

  • Impedance Control
    
    

  • Length Matching
    
    

  • Skew Budget
    
    

  • Via and Connector Impact
    
    

• Reference Plane Requirements
  
  

• Return Path and Stitching via Strategy
  
  

• Real-World Questions on USB/PCIe Layout Debug and Compliance
  
  

MODULE 3: High-Speed Layout Best Practices

• Stack-up Design for High-Speed Boards
  
  

• Controlled Impedance Routing
  
  

• High-Speed Signal Isolation Techniques
  
  

• Crosstalk Mitigation
  
  

• Practical DRC Rules to Know
  
  

• EMC/ESD Layout Considerations
  
  

MODULE 4: Interview Simulation & Mock Review

• Technical Mock Interviews
  
  

  • One-on-One Design Reviews
    
    

  • Problem-Solving Under Constraints
    
    

• Review of Common Mistakes in Layouts
  
  

• Resume/Portfolio Tips for PCB/Hardware Roles
  
  

• Final Q&A and Feedback
  
  

Who Should Join?

• PCB Layout Engineers preparing for senior roles
  
  

• Hardware Engineers moving into high-speed design
  
  

• SI/PI Engineers needing layout interview readiness
  
  

• Professionals aiming to switch into board-level design roles
  
  

Course Outcomes

🔹 Master the key concepts behind DDR, USB, and PCIe layout
🔹 Learn to answer interview questions with confidence and clarity
🔹 Gain practical tips to stand out in hardware design interviews
🔹 Improve your ability to review and defend your layout decisions

Contact for Enrollment

📞 Phone/whatsapp: +91 9448690910
📧 Email: HighspeedBoardDesignSimulation@gmail.com
🔗 LinkedIn: HighSpeedBoardDesign (Professional Trainer) Training Institute | LinkedIn