Course Content 

DDR: Introduction, Electrical Characteristics & Validation Process

📅 Course Duration: 2 Months
📍 Mode: Online / Hybrid
🎯 Ideal For: Hardware Engineers, Memory Interface Designers, Board Designers, and Validation Engineers

Course Overview

This course provides an in-depth understanding of DDR memory (DDR1 to DDR4, LPDDR variants), including its architecture, electrical characteristics, timing, and validation techniques. It’s designed for working professionals aiming to strengthen their memory subsystem knowledge and prepare for technical interviews in hardware and board-level roles.

Course Modules

Module 1: Introduction to DDR Memory

• Course Objectives and Structure
  
  

• Overview of System Architectures using DRAM
  
  

• DRAM in x86, ARM SoCs, Desktops, and Servers
  
  

• History and Evolution of DRAM Types
  
  

• DRAM Cell Architecture
  
  

  • Bit Line, Word Line, Sense Amplifier
    
    

  • Read/Write/Pre-Charge Basics
    
    

  • Open vs. Folded Cell Arrays
    
    

• DRAM Device Architecture (Banks, Rows, Columns)
  
  

Module 2: DDR Standards & Controller Basics

• DDR Generations: SDR, DDR1–DDR4, LPDDR1–LPDDR4, Wide IO
  
  

• Core Speed vs. I/O Speed
  
  

• Key Feature Comparisons from DDR1 to DDR4
  
  

• JEDEC Specifications Overview
  
  

• DDR Controller Architecture
  
  

  • Address/Control Mux, PLLs, Refresh Timers, Timing Generators
    
    

  • Addressing Schemes & Translation
    
    

Module 3: DRAM Modules & Pinout

• DRAM Modules: UDIMM, RDIMM, LRDIMM, SODIMM
  
  

• Concept of Ranks and Module Architectures
  
  

• Detailed Pinout Description
  
  

  • Clock, Control, Address, Command, Data, SPD, Power, Reference
    
    

  • Pinout comparison for DDR2, DDR3, DDR4, LPDDR2/3
    
    

• DDR Interfacing with ASIC/FPGA
  
  

Module 4: Commands, Timing & Refresh

• DDR3/DDR4 Bank States
  
  

• Read/Write Burst Diagrams and Timing
  
  

• Commands: Pre-charge, Auto Pre-charge, Refresh, Power-Down
  
  

• Asynchronous/Synchronous Reset
  
  

• DDR Address & Command Timing
  
  

• 3T Timing and CS# Latency
  
  

• Refresh Mechanisms
  
  

  • Per-Bank Refresh, Temp-Controlled, Partial Array, Self Refresh
    
    

  • Fast Exit, Abort, and Low Power Modes
    
    

Module 5: Electrical Specifications & SI

• Signaling Standards: SSTL, LVSTL
  
  

• On-Die Termination (ODT) in DDR3/DDR4
  
  

  • ODT Modes: Asynchronous, Synchronous, Dynamic, ODT Park
    
    

  • ODT Timing Examples
    
    

• Signal Integrity Considerations
  
  

  • DQS Timing, Impedance Control, Jitter, ISI, Data Eye Closure
    
    

• Power Management Techniques
  
  

  • Deep Power Down, Clock Throttling, MPSM
    
    

Module 6: PCB Layout & Routing Guidelines

• Routing Topologies: Point-to-Point, Fly-by
  
  

• Read/Write Path Routing Examples for DDR3/DDR4
  
  

• DDR Layout Guidelines for Signal Quality and Timing
  
  

• DDR Initialization Sequence
  
  

  • ZQ Calibration and Its Importance
    
    

  • ZQ Calculation Example
    
    

Contact for Enrollment

📞 Phone/whatsapp: +91 9448690910
📧 Email: HighspeedBoardDesignSimulation@gmail.com
🔗 LinkedIn: HighSpeedBoardDesign (Professional Trainer) Training Institute | LinkedIn