Research

 Our group is focusing on the advanced materials and innovative processes for heterogeneous integration (HI) technology that has attracted intensive attention in semiconductor industry. We are developing HI tech  through multi-disciplinary researches, in cooperation with other domestic and international research groups. HINT Lab is also conducting new real-time & in-situ measurement & analysis and industrial applications to electronic packaging, including thermoelectric energy conversion, rechargeable battery, and e-sensors, based on nanotechnology and electrochemistry.

Research projects in progress

1.  Electrochemical synthesis of single crystal Cu for 20 nm-scaling interconnect of semiconductor device (NRF-2023.03~2028.02, 700M KRW )

2.  Development of thermal modeling and heat-spreading architecture for heterogeneous integrating package of AI chiplets (IITP-2023.04~2027.12, 9,500M KRW)

3.  Routing design guided development of 3D scaling BEOL interconnect technology (KEIT-2023.04~2027.12, 3,000M KRW)

4.  Electronic transport in ultra-scaling interconnect materials of semiconductor device (Industry-2023.03~2025.02, 180M KRW)

5.  Development of Cu electroplating and thermal/mechanical evaluation technologies for RDL organic substrate (NRF-2023. 06~2027.12, 450M KRW)

6.  Electrochemical filling into the fractal nanostructures (Industry-2023.08~2024.07, 50M KRW)

Other Institutes for Research Collaboration

Domestic: KAIST, GIST, Hanbat National Univ., Hanyang Univ., Andong National Univ., KRISS, KANC, NEPES, ASICLAND, BAUM-DS

International: Georgia Inst. Tech., Brookhaven National Lab., UT Dallas