Hakan Ertürk, Ph.D. Professor, Mechanical Engineering
Boğaziçi University
I am a Professor in the Department of Mechanical Engineering in Boğaziçi University, Istanbul, where I founded and have been directing the Thermal and Energy Systems Laboratory.
I received my B.S., M.S. from Middle East Technical University, and Ph.D. from the University of Texas at Austin, working on inverse design and control of high temperature processing systems with Prof. Jack Howell.
Prior to my academic career, I worked for Intel Corporation, in Chandler, Arizona as a Senior Packaging Engineer where I focused on developing next generation thermal management technologies such as single / two phase cooling, thermo-electric integrated heat sinks and packages, phase change spreaders for mostly high performance computing, and also on heat spreading and / or piezo-fan based cooling systems for mobile and handheld devices.
My research bridges the gap between fundamental thermal sciences and practical applications, utilizing expertise in heat transfer, radiative transfer, optics and light scattering for design and optimization of thermal, optical and energy systems, thermal packaging and management of opto-electronic devices, and solving inverse problems in thermal sciences. Recently, my research group have been working on developing technologies for relying on particulate systems, such as band selective coatings, composite materials or engineered fluids. Our work focuses on manufacturing and characterization methods, multi-scale modeling, and developing novel technologies for energy harvesting, agriculture, building thermal management, and aerospace applications.
I have supervised more than 25 MS and PhD students, authored/co-authored more than 90 peer reviewed papers, several chapters in edited handbooks published by Elsevier, McGraw Hill and Springer, has more than 10 issued US and international patents.
I am also currently serving as an Editor for International Communications in Heat and Mass Transfer that is a SCI-Q1 journal published by Elsevier.