International Conferences
First Authored
DevFormer: A Symmetric Transformer for Context-Aware Device Placement
Haeyeon Kim*, Minsu Kim*, Federico Berto, Joungho Kim and Jinkyoo Park (* equal contribution)
Proceedings of the 40th International Conference on Machine Learning (ICML) 2023.
Learning Beyond Low-Quality Data Distribution: An Application to Optimal Decap Placement
Haeyeon Kim, Minsu Kim, Jinkyoo Park, and Joungho Kim
Proceedings of the DesignCon 2023.
Collaborative Symmetricity Exploitation for Offline Learning of Hardware Design Solver
Haeyeon Kim*, Minsu Kim*, Joungho Kim, and Jinkyoo Park (* equal contribution)
NeurIPS 2022 Offline RL Workshop.
Imitate Expert Policy and Learn Beyond: A Practical PDN Optimizer by Imitation Learning
Haeyeon Rachel Kim, Minsu Kim, Seonguk Choi, Jihun Kim, Joonsang Park, Keeyoung Son, Hyunwook Park, Subin Kim and Joungho Kim
Proceedings of the DesignCon 2022.
Deep Reinforcement Learning Framework for Optimal Decoupling Capacitor Placement on General PDN with an Arbitrary Probing Port
Haeyeon Kim, Hyunwook Park, Minsu Kim, Seonguk Choi, Jihun Kim, Joonsang Park, Seongguk Kim, Subin Kim,and Joungho Kim
Proceedings of the IEEE Electrical Performance of Electronic Packaging and Systems (EPEPS) 2021.
Co-Authored
[1] Subin Kim, Seungtaek Jeong, Boogyo Sim, Seongsoo Lee, Hyunwook Park, Haeyeon Kim, and Joungho Kim.,"Design and Analysis of On-package Inductor of an Integrated Voltage Regulator for High-Q Factor and EMI Shielding in Active Interposer based 2.5D/3D ICs," 2021 IEEE International Joint EMC/SI/PI and EMC Europe Symposium, 2021, pp. 498-503, doi: 10.1109/EMC/SI/PI/EMCEurope52599.2021.9559188.
[2] Minsu Kim, Hyunwook Park,Seonguk Choi, Haeyeon Rachel Kim, Seongguk Kim,Keeyoung Son,Keunwoo Kim,Daehwan Lho,Kyunjune Son,Subin Kim, and Joungho Kim, "Neural Language Model Enables Extremely Fast and Robust Routing on Interposer," in Proceedings of the DesignCon 2021.
[3] Minsu Kim, Hyunwook Park, Keeyoung Son, Seongguk Kim, Haeyeon Kim, Jihun Kim, Jinwook Song, Youngmin Ku, Jonggyu Park, and Joungho Kim., "Imitation Learning for Simultaneous Escape Routing," 2021 IEEE 30th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS), 2021, pp. 1-3, doi: 10.1109/EPEPS51341.2021.9609145.
[4] Joonsang Park, Minsu Kim, Seongguk Kim, Keeyoung Son, Taein Shin, Hyunwook Park, Jihun Kim, Seonguk Choi, Haeyeon Kim, Keunwoo Kim, and Joungho Kim., "Deep Reinforcement Learning-based Pin Assignment Optimization of BGA Packages considering Signal Integrity with Graph Representation," 2021 IEEE 30th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS), 2021, pp. 1-3, doi: 10.1109/EPEPS51341.2021.9609139.
[5] Seonguk Choi, Minsu Kim, Hyunwook Park, Keeyoung Son, Seongguk Kim, Jihun Kim, Joonsang Park, Haeyeon Kim, Taein Shin, Keunwoo Kim, and Joungho Kim., "Sequential Policy Network-based Optimal Passive Equalizer Design for an Arbitrary Channel of High Bandwidth Memory using Advantage Actor Critic," 2021 IEEE 30th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS), 2021, pp. 1-3, doi: 10.1109/EPEPS51341.2021.9609193.
[6] Jihun Kim, Hyunwook Park, Minsu Kim, Seongguk Kim, Seonguk Choi, Keeyoung Son, Joonsang Park, Haeyeon Kim, Jinwook Song, Youngmin Ku, Jonggyu Park, and Joungho Kim., "PAM-4 based PCIe 6.0 Channel Design Optimization Method using Bayesian Optimization," 2021 IEEE 30th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS), 2021, pp. 1-3, doi: 10.1109/EPEPS51341.2021.9609213.
[7] Seongguk Kim, Taein Shin, Hyunwook Park, Daehwan Lho, Keeyoung Son, Keunwoo Kim, Joonsang Park, Seonguk Choi, Jihun Kim, Haeyeon Kim, and Joungho Kim., "Signal Integrity Design and Analysis of a Spiral Through-Silicon Via (TSV) Array Channel for High Bandwidth Memory (HBM)," 2021 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS), 2021, pp. 1-3, doi: 10.1109/EDAPS53774.2021.9657033.
[8] Jihun Kim, Minsu Kim, Hyunwook Park, Jiwon Yoon, Seonguk Choi, Joonsang Park, Haeyeon Kim, Keeyoung Son, Seongguk Kim, Daehwan Lho, Keunwoo Kim, Jinwook Song, Kyungsuk Kim, Jonggyu Park and Joungho Kim, "Imitation Learning with Bayesian Exploration (IL-BE) for Signal Integrity (SI) of PAM-4 based High-speed Serial Link: PCIe 6.0," in Proceedings of the 2022 DesignCon.
[9] Joonsang Park, Minsu Kim, Seonguk Choi, Jihun Kim, Haeyeon Kim, Hyunwook Park, Seongguk Kim, Taein Shin and Joungho Kim, "Learning Super-scale Microbump Pin Assignment Optimization for Real-world PCB Design with Graph Representation," in Proceedings of the 2022 DesignCon.
[10] Seonguk Choi, Minsu Kim, Hyunwook Park, Haeyeon Kim, Joonsang Park, Jihun Kim, Keeyoung Son, Seongguk Kim, Keunwoo Kim, Daehwan Lho, Jiwon Yoon, Jinwook Song, Kyungsuk Kim, Jonggyu Park and Joungho Kim, "Deep Reinforcement Learning-based Channel-flexible Equalization Scheme: An Application to High Bandwidth Memory," in Proceedings of the 2022 DesignCon.
[11] Keeyoung Son, Seongguk Kim, Keunwoo Kim, Hyunwook Park, Minsu Kim, Taein Shin, Seonguk Choi, Joonsang Park, Jihun Kim, Haeyeon Rachel Kim and Joungho Kim, "Thermal Transmission Line: Smoothing Thermal Gradients and Lowering Temperature for Signal Integrity Improvement of HBM and 2.5D ICs," in Proceedings of the 2022 DesignCon.
[12] Daehwan Lho, Hyunwook Park, Keunwoo Kim, Seongguk Kim, Boogyo Sim, Kyungjune Son, Keeyoung Son, Jihun Kim, Seonguk Choi, Joonsang Park, Haeyeon Kim, Kyubong Kong and Joungho Kim, "Deterministic Policy Gradient-based Reinforcement Learning for DDR5 Memory Signaling Architecture Optimization considering Signal Integrity," in Proceedings of the 2022 IEEE Electrical Performance of Electronic Packaging and Systems.
[13] Kyungjune Son, Keunwoo Kim, Gapyeol Park, Daehwan Lho, Hyunwook Park, Boogyo Sim, Taein Shin, Joonsang Park, Haeyeon Kim, Kyubong Gong and Joungho Kim, "Signal Integrity and Power Leakage Optimization for 3D X-Point Memory Operation using Reinforcement Learning," in Proceedings of the 2022 IEEE Electrical Performance of Electronic Packaging and Systems.