Sahu, G., Weibel, J. A., Wei, T., Liquid and Vapor Separation in Liquid Jet Impingement Cooler for Low Surface Tension Fluids.
Sahu, G., Wei, T., Ultra Compact and Thin Lid Integrated Impingement Multi-jets Manifold for On-Chip Cooling.
Khandekar, S., Jaiswal, A. K., Sahu, G., “Spray Cooling: From Droplet Dynamics to System Level Perspectives”. Advances in Heat Transfer, 2022
J1. Patel, A., Yogi, K., Sahu, G. and Wei, T., 2025. Multi-Chip Jet Impingement Cooling for Heat Dissipation in 2.5 D Integrated System With 1 Kw+ Thermal Design Power. InternationalJournal of Heat and Mass Transfer, 244, p.126978. Link
J2. Sahu G., Khandekar S., and Muralidhar K., 2025, Effect of Nozzle Orifice Diameter and Position of Hydraulic Jump on Stagnation Point Heat Transfer During Liquid Jet ImpingementCooling. Journal of Flow Visualization and Image Processing, 32. Link
J3. Sahu, G., Li, R., Yogi, K., Patel, A., and Wei, T., 2024, Experimental Investigation of a Compact Lid-Compatible Multi-jet Impingement Manifold for Direct-On-Chip Cooling. IEEETransactions on Components, Packaging and Manufacturing Technology. Link
J4. Sahu, G., Khandekar, S., and Muralidhar, K., 2023, Effect of Liquid Splattering on Thermal Performance of Jets And Sprays over Plain And Pillared Surfaces, International Journal ofThermal Sciences, 187, 108131. Link
J5. Sahu G., Khandekar S., and Muralidhar K., 2022, Thermal Characterization of Spray Impingement Heat Transfer over a High-Power LED, Thermal Science and EngineeringProgress. Link
J6. Kumar P., Sahu G., Chatterjee D., and Khandekar S., 2022, Copper Wick Based Loop Heat Pipe for Thermal Management of a High-Power LED Module. Applied Thermal Engineering, 211,118459. Link
J7. Gatapova E. Ya., Sahu G., Khandekar S., and Hu R., 2021, Thermal Management of HighPower LED Module with Single-Phase Liquid Jet Array. Applied thermal engineering, 184,p.116270. Link
J8. Khandekar S., Sahu G., Muralidhar K., Gatapova E. Ya., Kabov O., Hu R., Luo X., and Zhao L., 2020, Cooling of High-power LEDs by Liquid Sprays: Challenges and Prospects. AppliedThermal Engineering, 184, p.115640. Link
J9. Sahu, G., Aljowaiser, O., Chen, J., Wei, T., Weibel, J. A., Pressure Gradient Induced Liquid Bulge during Spray Impingement from Pressure-Swirl Nozzle, (Ready for submission)
J10. Sahu, G., Wei, T., Weibel, J. A., Thermal Performance during Reduced Chamber PressureOperation of Spray Cooling, (Under preparation)
J11. Yogi, K., Sahu, G., Weibel, J. A., Wei, T., Thermal Performance Characterization of a ConfinedMulti-Liquid Impingement over Patterned Wick Structure, (Under preparation)
C1. Sahu, G., Yogi, K., Wei, T., and Weibel, J. A., 2025, Concept Design of a Confined, Direct Two-Phase Jet Impingement Cooler with Phase Separation of Low-Surface-Tension Fluids. ITherm, IEEE, USA
C2. Sahu, G., Hoang, D., Li, R., Yogi, K., Patel, A.H., and Wei, T., 2025, First Demonstration of Metal-Lidded Integral Microjet Impingement On-Chip Cooling Structures with Alternating Feeding and Draining Nozzles for High-Performance Interposer Packages. ECTC, IEEE, USA
C3. Patel, A.H., Yogi, K., Sahu, G., and Wei, T., September. A Novel Multi-Chip Cooling System Using Direct-on-Chip Jet Impingement for High-Performance Interposer Package. In 2024 International 3D Systems Integration Conference (3DIC), IEEE 2024, Japan
C4. Patel, A., Sahu G., and Wei, Tiwei., 2024, Heat Transfer Enhancement for Direct-on-Chip Impingement Jet Cooling using Variable Micro Pin Fins and Tapered Impingement Cavity, ITherm, IEEE, USA
C5. Ceperley, A., Sahu, G., Reicks, A., Zuhlke, C., Gogos, G., & Weibel, J. A., 2024, Characterization of Enhanced Two-Phase Jet Impingement on Femtosecond Laser Surface Processed (FLSP) Aluminum Surfaces. ITherm, IEEE, USA
C6. Sahu G., Khandekar S., and Muralidhar K., 2022, Thermal Performance Comparison of a LiquidJet and Spray Impinging on a Pillared Surface, FMFP, India
C7. Kumar P., Gachake M., Sahu G., and Khandekar S., 2021, Thermal Management of High-powerLED using a Copper Wick Loop Heat Pipe, Joint 20th IHPC and 14th IHPS, Gelendzhik, Russia
C8. Gatapova E. Ya., Sahu G., Khandekar S., Hu R., Cooling a Powerful LED Module, Topical Issuesof Thermophysics, Energetics and Hydrogasdynamics in the Arctic Conditions, Yakutsk, Russia,July 12-17, 2021
C9. Sahu G., Khandekar S., Muralidhar K., and Gatapova E. Ya., 2020, Heat Transfer Investigation of Spray Cooling for Thermal Management of a High-Power LED Module, 5th Thermal and Fluids Engineering Conference, New Orleans, USA
C10. Sahu G., Khandekar S., and Muralidhar K., 2019, Thermal Management of High-Power LightEmitting Diodes using Water Jet Impingement, ISHMT, India
C11. Sahu G., Khandekar S., and Muralidhar K., Mist Impingement Cooling on Smooth and PillaredSurface: A Comparative Study, Proc. 7th International and 45th National Conference on Fluid Mechanics and Fluid Power, Mumbai, India
C12. Sahu G., Naidu G. D., Khandekar S., and Muralidhar K., 2018, Thermal Management with LowPressure Water Jets and Air-Water Mist Impingement Cooling, 13th International Conference on Two -Phase Systems for Space and Ground Applications, Xi'an, China