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This thrust investigates architecture-packaging co-design methodologies to address the challenges in heterogeneous integration.
This thrust investigates architecture-packaging co-design methodologies to address the challenges in heterogeneous integration.
Key Focus Areas
Key Focus Areas
Tackling Warpage in Advanced packaging
Tackling Warpage in Advanced packaging
Architecture-packaging co-optimization
Advanced packaging with Si-Photonics
Advanced packaging with Si-Photonics
Silicon-Photonics Network-on-Interposer
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