Papers

• Field performance analysis of solar cell designs, J. Power Sources Adv., -, - (2024)

Sungho Hwang, Yoonmook Kang and Dongchul Suh

• Determination of chlorine in Hf precursors measured by high-resolution inductively coupled plasma mass spectrometry, J. Anal. At. Spectrom., 38, 1808 (2023)

Hanul Lee, Seongkyong Joo and Dongchul Suh

• Facile and precise quantitative determination of silicon in naphtha by inductively coupled plasma-optical emission spectroscopy, J. Anal. Sci. Tech., 13, 30 (2022)

Sungkyung Joo and Dongchul Suh

• Status and perspectives of Al2O3/TiO2-based anti-reflection and surface passivation for silicon solar cells, Phys. Status Solidi RRL, 15, 2100236 (2021)

Dongchul Suh

• Nanoscale wrinkles on a partially cured surface using polyurethane acrylate resins , Polym. Korea 43, 926 (2019)

Jeong-soo Kim, Se-jin Choi and Dongchul Suh

• Etch characteristics and morphology of Al2O3/TiO2 stacks for silicon surface passivation, Sustainability 11, 3857 (2019)

Dongchul Suh

• Investigation of copper etching with ferric nitrate solution, J. Nanosci. Nanotechnol. 19, 6347 (2019)

Jeong-soo Kim and Dongchul Suh

• Impact of buffer layer process and Na on shunt paths of monolithic series-connected CIGSSe thin film solar cells, Sci. Rep. 9, 3666 (2019)

Chan Bin Mo, Se Jin Park, Soohyun Bae, Mi-hwa Lim, Junggyu Nam, Dongseop Kim, Jung Yup Yang, Dongchul Suh, Byoung Koun Min, D W Kim, Yoonmook Kang, Young-su Kim, and Hae-Seok Lee

• Thermal stability of Al2O3/TiO2 stacks for boron emitter passivation on n-type silicon solar cells, Thin Solid Films, 669, 60 (2019)

Dongchul Suh

• Influence of laser damage and contact geometry on the performance of passivated emitter and rear cell solar cells, Thin Solid Films, 668, 45 (2018)

Dongchul Suh

• Minimizing light-induced degradation of the Al2O3 rear passivation layer for highly efficient PERC solar cells, ECS J. Solid State Sci. Technol. 7, Q253 (2018)

Chan Bin Mo, Sungeun Park, Soohyun Bae, Se Jin Park, Dongchul Suh, Young-Su Kim, Hyunjong Kim, and Yoonmook Kang

• Photovoltaic properties of perovskite-silicon hybrid solar cells: a strategy to achieve perovskite-based tandem cells, Nanosci. Nanotechnol. Lett. 10, 537 (2018)

Dongchul Suh, Jun-Sik Cho, Hyun Suk Jung

• Cost-Performance analysis for interdigitated back contact solar cells using the ion implantation process with a blanket shadow mask, Nanosci. Nanotechnol. Lett. 10, 548 (2018)

Jungho Song, Chanbin Mo, Dongseop Kim, Junggyu Nam, JungYup Yang, Dongchul Suh, Hyomin Park, Soohyun Bae, Se Jin Park, Sungeun Park, Hae-Seok Lee, Young-Su Kim, Yoonmook Kang, Donghwan Kim

• Optimization of controllable factors in the aluminum silicon eutectic paste and rear silicon nitride mono-passivation layer of PERC solar cells, Met. Mater. Int. 24, 664 (2018)

Sungeun Park, Hyomin Park, Dongseop Kim, JungYup Yang, Dongho Lee, Young-Su Kim, Hyun-Jong Kim, Dongchul Suh, Byoung Koun Min, Kyung Nam Kim, Se Jin Park, Donghwan Kim, Hae-Seok Lee, Junggyu Nam, Yoonmook Kang

• Efficient implementation of multiple drive-in steps in thermal diffusion of phosphorus for PERC solar cells, Curr. Appl. Phys. 18, 178 (2018)

Dongchul Suh

• Gapless point back surface field for the counter doping of large-area interdigitated back contact solar cells using a blanket shadow mask implantation process, Prog. Photovoltaics 25, 989 (2017)

Young‐Su Kim, Chanbin Mo, Doo Youl Lee, Sung Chan Park, Dongseop Kim, Junggyu Nam, JungYup Yang, Dongchul Suh, Hyun‐Jong Kim, Hyomin Park, Se Jin Park, Donghwan Kim, Jungho Song, Hae‐Seok Lee, Sungeun Park, Yoonmook Kang

• Facile and thermally-stable Al2O3 passivation by using in-situ TiO2 as a capping layer for boron emitter of n-type silicon, J. Nanosci. Nanotechnol. 17, 5003 (2017)

Dongchul Suh and Yoonmook Kang

• Continuously deposited anti-reflection double layer of silicon nitride and silicon oxynitride for selective emitter solar cells by PECVD, Curr. Appl. Phys. 17, 517 (2017)

Sungeun Park, Hyomin Park, Dongseop Kim, Junggyu Nam, Jung Yup Yang, Dongho Lee, Byoung Koun Min, Kyung Nam Kim, Se Jin Park, Seongtak Kim, Dongchul Suh, Donghwan Kim, Hae-Seok Lee, and Yoonmook Kang

• Electro-spray deposition of a mesoporous TiO2 charge collection layer: toward large scale and continuous production of high efficiency perovskite solar cells, Nanoscale 7, 20725 (2015)

Min-cheol Kim, Byeong Jo Kim, Jungjin Yoon, Jin-wook Lee, Dongchul Suh, Nam-gyu Park, Mansoo Choi, Hyun Suk Jung

• Shape modulation in deformation of Janus nanopillars, Sci. Adv. Mater. 6, 2474 (2014)

Dongchul Suh, Hyemin Lee, and Hyunsik Yoon

• Silicon surface passivation by atomic‐layer‐deposited Al2O3 facilitated in situ by the combination of H2O and O3 as reactants, Phys. Status Solidi RRL 8, 771 (2014)

Dongchul Suh and Wensheng Liang

• Effective silicon surface passivation by atomic layer deposited Al2O3/TiO2 stacks, Phys. Status Solidi RRL 8, 40 (2014)

Dongchul Suh and Klaus J. Weber

• Al2O3/TiO2 stack layers for effective surface passivation of crystalline silicon, J. Appl. Phys. 114, 154107 (2013)

Dongchul Suh, Duk-Yong Choi, and Klaus J. Weber

• Electrical properties of atomic layer deposited Al2O3 with anneal temperature for surface passivation, Thin Solid Films 539, 309 (2013)

Dongchul Suh and Wensheng Liang

• Surface passivation of boron diffused p-type silicon surfaces with (100) and (111) orientation by ALD Al2O3 layers, IEEE J. Photovolt. 3, 678 (2013)

Wensheng Liang, Klaus J. Weber, Dongchul Suh, Sieu Phang, Jun Yu, Andrew McAuley, and Bridget Legg

• Rigiflex lithography for nanostructure transfer, Adv. Mater. 17, 1554 (2005)

Dongchul Suh, Sejin Choi, and Hong H. Lee

• Unconventional patterning with a modulus-tunable mold: from imprinting to microcontact printing, Chem. Mater. 16, 5000 (2004)

Pil J. Yoo, Sejin Choi, Joon H. Kim, Dongchul Suh, Seung J. Baek, Tae W. Kim, and Hong H. Lee

• Bilayer reversal imprint lithography: direct metal-polymer transfer, Nanotechnology 15, 1103 (2004)

Dongchul Suh, Jungsoo Rhee, and Hong H. Lee

• Sub-100nm organic light-emitting diodes patterned with room temperature imprint lithography, J. Vac. Sci. Technol. B 22, 1123 (2004)

Dongchul Suh and Hong H. Lee 

- Room-Temperature Imprint Lithography was introduced under the heading "Cool stamped Chips" in the September issue (2001) of "Technology Review", a MIT magazine that has published reviews on technology since 1900.