My research experience covers the design, simulation, fabrication and characterization of optical and plasmonic devices.

On the computer (device design, simulation, optimization, data analysis, etc.):

• COMSOL: simulate optics, heat transfer, and mechanics.
• Matlab: solve analytical formulas and to process experimental data.
• Python: process data, and more.
• Zemax: ray tracing and optical lens design.
• Origin: plot data.
• Adobe Illustrator: create vector graphics and to generate simple 2D schematics.
• SolidWorks: render 3D schematics.
• LabVIEW: create customized graphical programs to control various equipments and enable automated measurements.
• L-Edit: create device layout for lithography.
• C (amateur): write programs to control certain experimental instruments.
• Microsoft office: process documents, presentation slides, and data files.

In the cleanroom (device fabrication):

• Electron-beam lithography (EBL): generate nanometer-scale patterns. Experienced in JEOL JBX-6300FS, Vistec VB6 and Vistec EBPG5200 systems.
• Photolithography: generate micrometer-scale patterns with a much higher throughput than EBL.
• Metal evaporation: deposit metal and perform liftoff to pattern plasmonic structures.
• Atomic layer deposition (ALD): grow high quality oxides.
• Scanning electron microscopy (SEM): image nanometer-scale structures which can not be resolved by visible light beyond diffraction limit.
• Plasma etching: etch graphene and clean substrates.
• Reactive ion etching (RIE): dry etch certain materials with plasma gases in an anisotropic manner (e.g. to get vertical sidewalls).
• Focused ion beam (ameteur): use focused gallium ion beams to "carve" nanostructures out of thin films.

In the lab (device characterization):

• VASE ellipsometer: retrieve optical properties of materials and to measure device performance (optical transmission, reflection, scattering, absorption, etc.).
• Fourier Transform Infrared Spectroscopy (FTIR): measure the optical transmission, reflection, and absorption of optical devices in the near to far infrared range.
• Raman T6400 CW laser and NKT Photonics SuperK super-continuum laser: use as light sources for photodetector experiments.
• Wire bonding: establish electrical connection between sample and chip carrier to facilitate characterization.
• Electrical equipment (Keithley sourcemeter, SRS lock-in amplifier): collect electrical signal in the photodetector experiments, under control by self-developed LabVIEW programs.
• Thermoreflectance (Prof. Ali Shakouri group at Purdue University): obtain thermal map on the sample when it is subject to laser illumination.