Dr. Feng Li

Buddhi Lamsal, Postdoc Fellow

(August 2023 - Present)

Ph.D. South Dakota State University

Catharine Chen, Ph.D. Student

(F2021 - Present)

Ultra-Wide Bandgap Semiconductor Device & Circuit

MSEE Beijing University of Posts & Telecommunications

Nathan Totorica, M.S. - Ph.D. Student

(F2021-F2023, S2023-Present)

ML/NN in VLSI Device and Circuit

BSEE University of Idaho

First job after grad: Micron

Jiaqi Shi, Ph.D. Student

(Fall 2023 - present)

3D IC Packaging

BSEE University of Idaho

Sai P. Goparaju,  M.S. Student

(Spring 2022 - present)

3D IC Packaging

Srividya Raveendran, M.S. 

(F2021 - S2023)

Nanoscale VLSI Device

BSEE Anna University

First job after grad: Micron

Zihao Huang, MEEE

(S2020 - S2021)

Power Semiconductor Device

BSEE University of Idaho

Qingyun Wang, MEEE

(F2020 - F2021)

RF Semiconductor Device

BSEE University of Idaho

Ronghui Yan, Visiting Scholar

(F2019)

Pattern Recognition

Soochow University

Yashashree Wase, MEEE 

(F2018 - S2019)

System in Package

BSEE Nagpur University

First Job after grad: Intel