Dr. Feng Li

Department of Electrical and Computer Engineering, University of Idaho

Journal Articles

Xiaoqing Chen, Feng Li, Herbert Hess, “Simulation of E-mode β-Ga2O3 Interlayer-Based Vertical Trench Power MOSFET with Fast-Switching Performance at High Temperatures.” IEEE Access, July 2025, doi: 10.1109/ACCESS.2025.3589533.
Feng Li, Jiaqi Shi, Buddhi Lamsal, "Flip chip bonding of SiC chips on screen printed alumina substrate for high temperature applications," IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 15, no. 6, pp. 1359-1366, June 2025, doi: 10.1109/TCPMT.2025.3537101.
Nathan Totorica, Wei Hu, Feng Li, "Simulation of different structured Gate-All-Around FETs for for 2nm node," Engineering Research Express, vol. 6, no. 3, 2024. DOI: 10.1088/2631-8695/ad62b0.
Feng Li, "Flip chip bonding for SiC integrated circuits with gold stud bumps for high temperature up to 600C applications," IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 14, no. 4, pp. 705-713, April 2024. DOI: 10.1109/TCPMT.2024.3378679.
Xiaoqing Chen, Feng Li, Herb Hess, "Design of enhancement mode β-Ga2O3 vertical current aperture MOSFETs with a trench gate," IEEE Access, vol. 12, pp. 42791-42801, 2024, doi: 10.1109/ACCESS.2024.3377563.
Xiaoqing Chen, Feng Li, Herbert Hess, "Trench gate β-Ga2O3 MOSFETs: a Review," Engineering Research Express, vol. 5, no. 1, pp. 1-14, 2023. doi: https://doi.org/10.1088/2631-8695/acc00c.
Feng Li, "3D stacking of SiC integrated circuit chips based on gold wire bonded interconnects for long-duration high-temperature applications," IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 12, no. 10, pp. 1601-1608, Oct. 2022. doi: 10.1109/TCPMT.2022.3210477. (Featured cover article)
Nathan Totorica, Feng Li, "Signal and power integrity challenges for high density system-on-package," Semiconductor Science and Information Devices, Vol. 4., no. 2, pp. 1-9, 2022. doi: 10.30564/ssid.v4i2.4475.
Mario Di Cino, Feng Li, "Flip chip die-to-wafer bonding review: gaps to high volume manufacturing," Semiconductor Science and Information Devices, Vol. 4, no. 1, pp. 8-13, 2022. doi: 10.30564/ssid.v4i1.4474.
Md Jubayer Shawon, Feng Li, “A review of the building blocks of silicon photonics: from fabrication perspective,” Semiconductor Science and Information Devices, Vol.1, no. 1, pp. 29-35, October 2019. doi: 10.30564/ssid.v1i1.1282.
Feng Li, “S electrode materials,” In: Inorganic Battery Materials, Encyclopedia of Inorganic and Bioinorganic Chemistry, R. A. Scott (Ed.). John Wiley & Sons, Ltd, pp. 59-74, 2019. doi:10.1002/9781119951438.eibc2653.
Feng Li, Qing H. Liu, David P. Klemer, “Numerical simulation of high electron mobility transistors based on the spectral element method,” Applied Computational Electromagnetics Society Journal, vol. 31, no. 10, pp. 1144-1150, October 2016.
Feng Li, Qing H. Liu, David Klemer, “Plasmon resonance effects in GaAs/AlGaAs heterojunction devices: an analysis based on spectral element simulation,” IEEE Transactions on Electron Devices, vol. 61, no. 5, pp. 1477-1482, May 2014. doi: 10.1109/TED.2014.2311473.

Conference Papers

Feng Li, "Surface passivation and insulation for 3-D stacking of SiC integrated circuits for high-temperature applications," 2023 International Conference and Exhibition on High-Temperature Electronics (HiTEC), Albuquerque, NM, USA, 2023.
Feng Li, Jiaqi Shi, "Metal-to-metal flip-chip bonding for high-temperature 3D SiC IC integration and Packaging," 2023 IEEE Workshop on Microelectronics and Electron Devices (WMED), Boise, ID, USA, 2023, doi: 10.1109/WMED58543.2023.10097447.
C. Braase, M. Mooney-Rivkin, P. Piedmont, G. Wells, C. Wiegert, S. Garcia, K. Olds, A. Brock, M. Murbach, F. Li, "Low-cost attitude determination and control along a single axis for NASA's technical and educational satellite project," 2022 19th International Planetary Probe Workshop (IPPW 2022), Santa Clara, CA, August 29-September 2, 2022.
Feng Li, Srividya Raveendran, "Wirebonding based 3D SiC IC stacks for high temperature applications," 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC), pp. 2023-2027. doi: 10.1109/ECTC51906.2022.00319.
Wei Hu, Feng Li, "Scaling beyond 7nm node: an overview of gate-all-around field effect transistors," 2021 9th International Symposium on Next Generation Electronics (ISNE), pp. 1-6. doi: 10.1109/ISNE48910.2021.9493305.
Feng Li, Qianyi Li, Andrew Owens, “Micro-bump processing for 3D IC integration,” IMAPS Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT): January 2019, Vol. 2019, No. DPC, pp. 001028-001049. doi: 10.4071/2380-4491-2019-DPC-Presentation_WP2_049
Mathew Binggeli, and Feng Li, “Scaling optical communication for on-chip interconnect,” 2018 19th International Conference on Electronic Packaging Technology (ICEPT), 2018, pp. 1178-1183, doi: 10.1109/ICEPT.2018.8480739.
Yi Yang and Feng Li, "Recent Advances in 3D Packaging for Medical Applications," 2018 19th International Conference on Electronic Packaging Technology (ICEPT), 2018, pp. 1193-1197, doi: 10.1109/ICEPT.2018.8480435.
Yashashree S. Wase and Feng Li, "Technology Review of System in Package". IMAPS Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT): January 2017, Vol. 2017, No. DPC, pp. 1-20. doi: 10.4071/2017DPC-TP1_Presentation1.
Feng Li, David Klemer, Shun Mao, Junhong Chen, “Fabrication and characterization of microwave immunosensors based on organic semiconductors with nanogold-labeled antibody,” 30th Annual International Conference of the IEEE Engineering in Medicine and Biology Society, 2008, pp. 2381-2384, doi: 10.1109/IEMBS.2008.4649678.
Feng Li, Purnomo S. Priambodo, Nanalya Dallas, Monica Rege, Meng Tao, Theresa A. Maldonado, Ming Zhou, Martin Pomerantz, Robert Magnusson, “Growth of monolayered organic films for nanostructured nonlinear photonic devices,” IEEE Conference on Lasers and Electro-Optics, CLEO ’03, pp. 792-793, 2003.
Feng Li, Purnomo S. Priambodo, Nanalya Dallas, Monica Rege, Meng Tao, Theresa A. Maldonado, Ming Zhou, Martin Pomerantz, Robert Magnusson, “Growth of monolayered organic films for nanostructured nonlinear photonic devices,” OSA Trends in Optics and Photonics Series, vol. 88, pp. 795-796, June 2003.

Page updated

Google Sites

Report abuse