Feng Li, Ph.D., P.E.

Micron Endowed Professor in Microelectronics

Department of Electrical and Computer Engineering, University of Idaho

875 Perimeter Drive, Moscow, Idaho 83844-1023, USA

Phone: (208) 885-7571, Email: fengli@uidaho.edu

Biography

Feng Li is the Micron Endowed Professor in Microelectronics, Director of the Next-Generation Microelectronics (NGeM) Research Center, and Director of Idaho Microelectronics Laboratory at the University of Idaho. Dr. Li's research interests include the design and fabrication of silicon and compound semiconductor devices and ICs, 3D IC integration and packaging, and VLSI design and manufacturing. He is a senior member of the Institute of Electrical and Electronics Engineers (IEEE), and a member of the International Microelectronics Assembly & Packaging Society (IMAPS).

Dr. Li received a Ph.D. degree in Electrical Engineering, with a minor in Computer Science, from the University of Wisconsin - Milwaukee, Wisconsin, USA, in 2012. His past affiliations include the Nano and Micro Integrated Systems Center at Duke University and the Shimadzu Institute Nanotechnology Research Center at the University of Texas at Arlington.

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