International Conference on Cyber-enabled Distributed Computing and Knowledge Discovery (CyberC-2024) Workshop on

Advanced Optimization and Learning for 

Distributed and Intelligent Systems

Call for Papers

Fueled by the seamless integration of wireless communications, signal processing, edge computing, and artificial intelligence (AI), AI model training and inference can now be conducted over wireless networks, leveraging vast amounts of distributed data from heterogeneous users. This gives rise to distributed and intelligent systems, such as intelligent transportation, smart healthcare, and industrial IoT. Nevertheless, the imperfections and heterogeneity of these networks necessitate the optimization of data sensing, processing, transmission, and analytics to facilitate efficient distributed AI model training in distributed and intelligent systems. Moreover, the dynamic nature of system dynamics and user demands calls for the design of machine learning and optimization strategies that can achieve efficient, adaptive, and real-time AI model inference—a task that poses significant challenges. This workshop aims to convene experts and researchers from academia and industry to tackle both fundamental and practical issues related to advanced optimization and learning for distributed and intelligent systems.

The organizing committee cordially invites submissions of original, unpublished, high-quality research papers that contribute to the development of advanced optimization and learning for distributed and intelligent systems. Topics of interest include, but are not limited to:


Submission Details:

Submission Link: https://edas.info/N32572

Format: We accept 4-page submissions following standard IEEE two-column format. Paper templates can be found at: https://www.ieee.org/conferences/publishing/templates.html.

Note: All accepted papers will be included in the Proceeding and be submitted to EI as other IEEE conferences. CyberC 2024 provides a special channel for you to submit your extended version to Electronics, an open-access journal by MDPI. After submission of a CyberC version, you can submit an extended version to the Journal after the conference. More details can be found at CyberC and Special Issue.

Key Dates

Submission deadline: 08/20/2024 

Notification of acceptance: 09/10/2024 

Registration due date: 09/20/2024 

Camera-Ready Paper Submissions and Copyrights Due: 09/20/2024 

Conference date: 10/24/2024-10/26/2024 

Organizing Committee 

Sheng Zhou

Tsinghua University, China

Qin Lu

University of Georgia, USA

Shijian Gao

HKUST (Guangzhou), China

Jia Yan

HKUST (Guangzhou), China

Xinhu Zheng

HKUST (Guangzhou), China

Bingcong Li

  ETH Zurich,   Switzerland

Keynote Speakers

University of Macau, China


South China University of Technology, China

Yuan Wu is currently an Associate Professor with the State Key Laboratory of Internet of Things for Smart City, University of Macau, Macao, China, and also with the Department of Computer and Information Science, University of Macau. He received the PhD degree in Electronic and Computer Engineering from the Hong Kong University of Science and Technology in 2010. His research interests include resource management for wireless networks, green communications and computing, edge computing and edge intelligence, and energy informatics. He received the Best Paper Award from the IEEE ICC’2016, IEEE TCGCC’2017, IWCMC’2021, and IEEE WCNC’2023. Dr. Wu is currently on the editorial board of IEEE TRANSACTIONS ON VEHICULAR TECHNOLOGY, IEEE TRANSACTIONS ON NETWORK SCIENCE AND ENGINEERING, and IEEE INTERNET OF THINGS JOURNAL.


Huaiguang Jiang is a tenured Professor of the School of Future Technology, South China University of Technology. He is now a standing committee member of Guangzhou Youth Federation and deputy director of Science and Technology Field, his research attention focuses on low-carbon intelligent energy and unmanned automation . He was selected as a National-level young talent, and has undertaken and participated in scientific research projects at national and other levels for many times, with a total project fund of more than 10 million RMB. As a senior member of IEEE, he has published more than 50 Chinese and English papers and works in related fields, with a total impact factor of more than 100, invited to publish 2 English academic monographs, participated in, chaired and organized the top Chinese and English conferences for many times, and was invited to review more than 20 top journals and top conferences in the industry.

TPC Members 

Lu Bai, Shandong University

Shaoyi Du, Xian Jiaotong University

Ziwei Huang, Peking University

Xian Li, Shenzhen University

Zehong Lin, HKUST

Hang Liu, Cornell Tech

Konstantinos D. Polyzos, University of Minnesota

Alireza Sadeghi, University of Minnesota

Hanlin Tang, Huawei Tech

Xiao Wang, Anhui University

Xi Wei, Xian Jiaotong University

Yilang Zhang, University of Minnesota

Hao Zhou, University of McGill