Resource Persons 

Tom Dory
Retired R&D manager of Fujifilm Electronic Materials

Aashish Shah
Senior Principal Engineer and Technical Lead of the Ball Bonder Process and Ultrasonics R&D teams Kulicke and Soffa Industries, Inc 

Vikas Gupta
Director Engineering and Technical Marketing team, focusing on advanced packaging technologies for automotive and power electronics 

Habib Hichri
Executive Vice President, Senior Fellow Global Applications and Business Development at Ajinomoto Fine Techno Corporation USA 

Ivan Ndip
Professor at the Brandenburg University of Technology (BTU), Cottbus-Senftenberg in Germany. 

Jeff Gotro
Expert in the field of polymeric materials for advanced electronic packaging applications and composites

Shalabh Tandon
Expert in semiconductor Quality and Reliability (Q&R), product development, behaviour of polymers and high-volume manufacturing. 

Venky Sundaram
Advanced Semiconductor Packaging

Founder & Principal Founder & Principal 3D System Scaling LLC 

Beth Keser
IMAPS VP of Technology and VP of Packaging at the photonics start-up Volantis
IEEE Fellow and EPS Distinguished Lecturer. 

Shubhada Sahasrabudhe
senior technical leader in semiconductor Quality and Reliability (Q&R). 

Henri Seppanen
Research Scientist at Kulicke & Soffa Industries