4th Professional Development Course (PDC)
Introduction to Semiconductor Legacy & Advanced Packaging (IS-LAP)
10 Jan - 1 Feb 2026 | Virtually | Weekends
10 Jan - 1 Feb 2026 | Virtually | Weekends
Aashish Shah
Senior Principal Engineer and Technical Lead of the Ball Bonder Process and Ultrasonics R&D teams Kulicke and Soffa Industries, Inc
Vikas Gupta
Director Engineering and Technical Marketing team, focusing on advanced packaging technologies for automotive and power electronics at ASE Group
Habib Hichri
Executive Vice President, Senior Fellow Global Applications and Business Development at Ajinomoto Fine Techno Corporation USA
Ivan Ndip
Professor at the Brandenburg University of Technology (BTU), Cottbus-Senftenberg, Germany.
Jeff Gotro
Expert in the field of polymeric materials for advanced electronic packaging applications and composites,
InnoCentrix LLC
Shalabh Tandon
Expert in semiconductor Quality and Reliability (Q&R), product development, behaviour of polymers and high-volume manufacturing.
QuRIuS Consultancy
Venky Sundaram
Advanced Semiconductor Packaging
Founder & Principal Founder & Principal 3D System Scaling LLC
Beth Keser
IMAPS VP of Technology and VP of Packaging at Volantis Semiconductor
IEEE Fellow and EPS Distinguished Lecturer.
Shubhada Sahasrabudhe
senior technical leader in semiconductor Quality and Reliability (Q&R).
QuRIuS Consultancy