Cross-Domain Biometric Recognition Workshop
In Conjunction with IEEE Winter Conference on Applications of Computer Vision (WACV) 2018
CALL FOR PAPERS
Workshop on Cross-Domain Biometric Recognition (CDBR)
co-located with
IEEE Winter Conf. on Applications of Computer Vision
March 15, 2018, Lake Tahoe, NV/CA.
Important dates:
Paper Submission: January 5th, 2018 January 20th, 2018
Author notification: January 26th, 2018 January 31st, 2018
Camera-ready Paper due: February 2nd, 2018
Workshop: March 15, 2018
About the 1st International Workshop on Cross-Domain Biometric Recognition 2018:
This workshop will focus on cross-domain technology and applications for biometric recognition, such as face, iris, and fingerprint modalities. Cross-domain technology includes methods for matching source data from one domain with target data from another domain (e.g., infrared to visible face, cross-wavelength iris, 3D-to-2D fingerprint).
Topics of interest include:
- Domain Adaptation techniques for face, finger and iris recognition
- Sensors (visible, infrared, polarimetric, LiDAR, and emerging sensing technologies)
- Face detection in the HFR scenario
- Fiducial point detection / face alignment in HFR (in infrared, thermal, sketches)
- Face recognition at a distance (low resolution to high resolution matching)
- Infrared (near-infrared, thermal) to visible face matching
- Face sketch (hand sketch, forensic sketch) to visible face recognition
- Cross-wavelength Iris (matching across IR sub-bands)
- NIR-to-Visible Iris recognition
- Touch to touchless fingerprint recognition
- 3-D to 2D fingerprint recognition
- Cross-Domain Biometrics applications
- Surveillance, Law enforcement applications
Submissions:
Submission are handled via CDBR2018 CMT page. See Submissions page for more details. The manuscripts should be submitted in PDF format and should be no more than 8 pages in IEEE WACV paper format. The submitted papers should present original work. Accepted papers will be included in the Proceedings of IEEE WACV 2018 & Workshops and will be sent for inclusion into the IEEE Xplore digital library.