Professor

 Biography

Seong-Jin Kim received his B.S. degree in Electrical Engineering from Pohang University of Science and Technology (POSTECH), Pohang, Korea, in 2001. He received his M.S. and Ph.D. degrees in Electrical Engineering from Korea Advanced Institute of Science and Technology (KAIST), Daejeon, Korea, in 2003 and 2008, respectively.

From 2008 to 2012, he was a research staff member at Samsung Advanced Institute of Technology (SAIT) in Yongin, Korea, where he engaged in the development of CMOS imagers for the real-time acquisition of 3-D images. From 2012 to 2015, he worked for the Institute of Microelectronics (IME), A*STAR in Singapore, where he was involved in the design of analog-mixed signal circuits for various sensing systems. From 2015 to 2024, he worked for the School of Electrical and Computer Engineering at Ulsan National Institute of Science and Technology (UNIST) in South Korea. In 2024, he joined the Department of Electrical Engineering at Sogang University in South Korea, where he is currently an Associate Professor. He is a co-founder of SolidVue, a LiDAR startup company in South Korea. His current research interests include high-performance imaging devices, LiDAR systems, and biomedical interface circuits and systems.

Dr. Kim has been a member of the Technical Program Committee at the International Solid-State Circuit Conference from 2019 to 2024, and the Country Representative of South Korea for the ISSCC Far-East Region in 2021.

 Education

Mar. 2003 – Feb. 2008   Ph.D. in the Department of Electrical Engineering at KAIST

Mar. 2001 – Feb. 2003   MS in the Department of Electrical Engineering at KAIST

Mar. 1997 – Feb. 2001   BS in the Department of Electrical Engineering at POSTECH

 Professional Experience

Sep. 2024 – Present   Professor in the Department of System Semiconductor Engineering at Sogang University, Seoul, Korea 

Nov. 2020 – Present   Chief Scientist at SolidVue Co.

Aug. 2022 – Jul. 2023   Visiting Research Scholar in the Department of Bioengineering at the University of California, San Diego, US
Mar. 2020 – Aug. 2024   Associate Professor in the Department of Electrical Engineering at UNIST

Jul. 2015 – Feb. 2020   Assistant Professor in the School of Electrical and Computer Engineering at UNIST
Jun. 2012 – Jun. 2015   Scientist II (Senior Research Staff) in Institute of Microelectronics (IME), A*STAR, Singapore
Jan. 2008 – May. 2012   Research Staff in Samsung Advanced Institute of Technology (SAIT, 삼성종합기술원)
Sep. 2006 – Nov. 2007   Pre-doctoral Researcher in the Department of Electrical Engineering and Computer Science at the University of Minnesota, Twin Cities, US

 Invited Talks and Seminars

1. Tutorial at Asian Solid-State Circuits Conference (A-SSCC), Daejeon, Korea, “CMOS Time-of-Flight Sensors,” Nov. 2025.

2. Technical Seminar at IMEC-KUL-POSTECH Workshop, Leuven, Belgium, “Pushing the Limits of Depth Sensing: CMOS Time-of-Flight and SPAD-Based Approaches,” Oct. 2025.

3. Tutorial at Asia Pacific Conference on Circuits and Systems, Busan, Korea, “SPAD-Based Solid-State LiDAR in CMOS: From Fundamentals to State-of-the-Art Integration,” Oct. 2025.

4. Tutorial at Summer Annual Conference of the ISE, Yeosu, Korea, “SPAD-Based Direct Time-of-Flight Sensors,” Jul. 2025.

5. Invited Talk at 2025 Korean Image Sensor Workshop (KISW), Dongguk University, Seoul, Korea, “SPAD-Based Flash LiDAR Sensors with In-pixel Histogramming TDC Architectures,” Jul. 2025.

6. Technical Seminar at University of Edinburgh, Edinburgh, United Kingdom, “SPAD-Based Flash LiDAR Sensors with In-pixel Histogramming TDC Architectures,” May. 2025.

7. Invited Talk at Samsung Global Technology Conference, Seoul, Korea, “Toward Scalable Neural Recording: Advances and Challenges in Neural Interface ICs,” Apr. 2025.

8. Invited Talk at IEIE Workshop, Seoul, South Korea, “SPAD-Based Flash LiDAR Sensors for Enabling Self-Driving Cars and Metaverse,” Apr. 2025.

9. Invited Talk at Advanced in Analog Circuits (AACD), University of Twente, Enschede, the Netherlands, “SPAD-Based Flash LiDAR Sensors with In-pixel Histogramming TDC Architectures,” Mar. 2025.

10. Invited Talk at IEEE CASS Seasonal School, Sogang University, Seoul, Korea, “A CMOS Microelectrode Array System With Reconfigurable Sub-Array Multiplexing Architecture,” Dec. 2024.

11. Invited Talk at IEEE CASS R10 Workshop, Sogang University, Seoul, Korea, “CMOS Flash LiDAR Sensors with In-pixel Zoom Histogramming TDC Architectures,” Nov. 2024. 

12. Invited Talk at International SPAD Sensor Workshop (ISSW), Trento, Italy, “CMOS Flash LiDAR Sensors with In-pixel Zoom Histogramming TDC Architectures,” Jun. 2024.

13. Invited Talk at IMEC, Leuven, Belgium, “CMOS SPAD-Based LiDAR Sensors with Zoom Histogramming TDC Architectures,” Feb. 2024.

14. Technical Seminar at Nemesis, Seongnam, Korea, “A Chopper Instrument Amplifier for Wearable ExG Monitoring Devices,” Nov. 2023.

15. Invited Talk at 최신 반도체 집적회로 설계 기술 Workshop, Seongnam, Korea, “Solid-State CMOS LiDAR Sensors,” Nov. 2023.

16. Invited Talk at Huazhong University of Science and Technology (HUST), Wuhan, China, “CMOS SPAD-Based LiDAR Sensors with Zoom Histogramming TDC Architectures,” Nov. 2023.

17. Invited Talk at University of Electronic Science and Technology of China (UESTC), Chengdu, China, “CMOS SPAD-Based LiDAR Sensors with Zoom Histogramming TDC Architectures,” Nov. 2023.

18. Invited Talk at Asian Solid-State Circuits Conference (A-SSCC), Haikou, China, “CMOS Time-of-Flight Sensors for Enabling Self-Driving Cars and Metaverse,” Nov. 2023.

19. Tutorial at International Solid-State Circuits Conference (ISSCC), San Francisco, US, “Solid-State CMOS LiDAR Sensors,” Feb. 2023.

20. Technical Seminar, Samsung Advanced Institute of Technology (SAIT), On-line, “A CMOS Microelectrode Array System With Reconfigurable Sub-Array Multiplexing Architecture,” Feb. 2023.

21. Invited Talk at International Workshop on Image Sensors and Imaging Systems (IWISS), Hamamatsu, Japan, “CMOS SPAD-Based LiDAR Sensors with Zoom Histogramming TDC Architectures,” Dec. 2022.

22. Technical Seminar, Samsung Electronics, Online, “A CMOS LiDAR Sensor with Analog-Assisted In-Pixel Histogramming Time-to-Digital Converter,” Nov. 2022.

23. Invited Talk at Univ. of California, San Diego, US, “A CMOS Microelectrode Array System With Reconfigurable Sub-Array Multiplexing Architecture,” Nov. 2022.

24. Technical Lecture at IDEC, Kyungpook National University, Daegu, Korea, “CMOS Time-of-Flight Sensors,” Jul. 2022.

25. Invited Talk at Korean Conf. Semiconductors, Jeongseon, Korea, “A Chopper Instrument Amplifier for Wearable ExG Monitoring Devices,” Jan. 2022.

26. Invited Talk at Summer Annual Conference of the ISE, Namhae, Korea, “Solid-State CMOS LiDAR Sensors,” Jul. 2021.

27. Invited Talk at Summer Annual Conference of the IEIE, Jeju, Korea, “A High-Input Impedance Chopper Amplifier with Dual Positive Feedback Loop for Neural Recording Front Ends,” Jun. 2021.

28. Technical Seminar, Dongbu Hitek, Eumseong, Korea, “Solid-State Imaging and Ranging: Beyond Human Eyes,” Feb. 2021.

29. Technical Seminar, SK Hynix, Icheon, Korea, “Solid-State LiDAR Based on CMOS Direct ToF Sensors,” Dec. 2019.

30. Invited Talk at 제2회 반도체공학회 학술대회, Seoul, Korea, “A Sub-μW/Ch Analog Front-End for Δ-Neural Recording With Spike-Driven Data Compression,” Dec. 2019.

31. Technical Seminar, Dongbu Hitek, Eumseong, Korea, “Solid-State LiDAR Based on CMOS Direct ToF Sensors,” Dec. 2019.

32. Technical Seminar, Samsung LSI, Hwaseong, Korea, “Solid-State LiDAR Based on CMOS Direct ToF Sensors,” Nov. 2019.

33. Technical Seminar, LG Electronics, Seoul, Korea, “Principles of CMOS ToF Sensors,” Nov. 2019.

34. Technical Seminar, SK Hynix, Icheon, Korea, “Principles and Demodulation Pixel Structures of ToF Sensors,” Mar. 2019.

35. Technical Seminar, LG Innotek, Ansan, Korea, “CMOS Time-of-Flight Sensors,” Dec. 2018.

36. Technical Seminar, Korea Research Institute of Chemical Technology (KRICT, 한국화학연구원), Ulsan, Korea, “Solid-State LiDAR: CMOS Time-of-Flight (ToF) Sensors,” Dec. 2018.

37. Invited Talk at 한국센서학회 종합학술대회, Daejeon, Korea, “Solid-State LiDAR: CMOS Time-of-Flight (ToF) Sensors,” Nov. 2017.

38. Invited Talk at 16th RF/Analog Workshop, Jeju, Korea, “Low Power Implantable Neural Recording System,” Sep. 2016.

39. Invited Talk at 고감도 광검출 응용기술 워크샵, Busan, Korea, “The Principle of CMOS TOF Sensors,” Aug. 2016.

40. Technical Seminar, Korea Institute of Science and Technology (KIST, 한국과학기술연구원), Seoul, Korea, “Integrated Smart Sensors for New Human-Computer Interfaces,” Feb. 2016.

41. Technical Seminar, ATECH Solution, Hwaseong, Korea, “The Principle of TOF Depth Sensors,” Feb. 2016.

42. Invited Talk at 12th International SoC Design Conference (ISOCC), Gyeongju, Korea, “An Implantable Neural Recording IC with In-Situ Spike Detection and Preservation,” Nov. 2015.

43. Technical Seminar, Korea Research Institute of Standards and Science (KRISS, 한국표준연구원), Daejeon, Korea, “Integrated Smart Sensors for New Human-Computer Interfaces,” July. 2015.

44. Technical Seminar, College Electronics & Information, Kyung Hee University, Yongin, Korea, “Integrated Microsystems for Detection and Recognition of Natural Signals,” Jun. 2014.

45. Invited Talk at Asia-Korea Conference on Science and Technology (AKC 2013), Singapore, “A CMOS Image Sensor with Unified Pixel Architecture for 2-D/3-D Image Acquisition,” Nov. 2013.

46. Tutorials at IEEE Int. Conf. Image Processing (ICIP), Brussels, Belgium, “ToF (Time of Flight) Depth Sensor Image Processing: from Principle to Applications,” Sep. 2011.

47. Invited Talk at Optical Society of Korea Conference, Seoul, Korea, “A VGA 3D Image Sensor Based on Unified Pixel Structure,” Feb. 2011.

48. Technical Seminar, Korea Research Institute of Bioscience & Biotechnology (KRIBB), Daejeon, Korea, “Label-free CMOS DNA Sensor with On-chip Noise Reduction Scheme for Real-time DNA Quantification,” Dec. 2007.