Atomic layer deposition (ALD) is deposited layer by layer due to a self-limiting reaction. Using these characteristics, it is possible to control a thin film's doping level or manufacture an ultrathin film.
Sputtering is a deposition process with high reproducibility of thin films, which can deposit various materials such as metals and ceramics. Also, the film composition can be controlled using co-sputtering.
The catalyst was deposited according to each fuel (Hydrogen, Methane, Methanol), and the deposition method differed according to the thickness or porosity.
For the fabrication of anode support-based TF-SOFC, ALD or sputtering process was appropriately used for each part, and the pore size of the substrate was changed according to the fuel to secure optimal performance.