RESEARCH
My research vision is to manufacture catalysts on various scales (from nm to um) and apply them to energy devices.
CATALYST DEPOSITION METHOD
Design and Manufacture ALD Station
Atomic layer deposition (ALD) is deposited layer by layer due to a self-limiting reaction. Using these characteristics, it is possible to control a thin film's doping level or manufacture an ultrathin film.
Sputtering
Sputtering is a deposition process with high reproducibility of thin films, which can deposit various materials such as metals and ceramics. Also, the film composition can be controlled using co-sputtering.
I designed and manufactured various types of ALD stations. The catalyst is deposited in the nm scale by ALD and in um scale by sputtering.
THE CATALYSTS FOR LT-SOFC USING VARIOUS FUELS
The catalyst was deposited according to each fuel (Hydrogen, Methane, Methanol), and the deposition method differed according to the thickness or porosity.
THIN FILM LT-SOFC
For the fabrication of anode support-based TF-SOFC, ALD or sputtering process was appropriately used for each part, and the pore size of the substrate was changed according to the fuel to secure optimal performance.