Research

1. mmWave/Sub-THz RADAR/Lidar Sensors

mmWave/Sub-THz radar designs for improved range resolution and displacement detection capability.
System level study based on different detection/sensing scenarios for optimal RF transceiver architecture designs.
Radar IC designs including amplifiers, frequency multipliers, mixers, VCOs, filters and analog baseband circuits.
IC designs considering an interface to antennas and packages (ex. on-chip antenna designs, flip-chip modules).
Design of Lidar and sensor fusion systems.

2. CMOS/Compound Semiconductor-Based Transceivers

Design of CMOS/III-V-based transceiver ICs for next generation wireline/wireless communication systems (ex. B5G).
Digital functionality supported by standard CMOS technologies.
High-speed and high-frequency IC designs with compound semiconductor technologies to overcome the limited output power and speed (ex. fmax of 28-nm CMOS < 300 GHz) of CMOS technologies.
CMOS + GaN integration for 5G/6G communication systems (ex. GaN ICs for 6G at 7~24 GHz).
CMOS + InP integration for D-band (110~170 GHz) 6G communication systems.

3. Joint Communication and Sensing (JCAS) Transceivers

Developing integrated circuits for joint communication and sensing transceivers.
Vehicle-to-Vehicle (V2V), Vehicle-to-Everything (V2X) systems.
Shared IC designs for communication and radar systems.