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Ultrahigh vacuum sputtering system
Ultrahigh vacuum sputtering system
Base pressure: <1.0×10-8 Torr (main chamber), <5.0×10-8 Torr (2nd chamber)
11 sputtering guns: 7guns for main chamber and 4 guns for 2nd chamber
Deposition temperature 300 K < T < 1100 K
Location: 305A
Probe station with electromagnet
Probe station with electromagnet
Measurements for spin-orbit torque (harmonics and switching) and magnetoresistance of patterned devices
Magnetic field ~2 T
Two lock-in amplifiers (SR830), one source meter (Keithley 6221), one nanovoltmeter (Keithley 2182) driven by LabView
Location: 305A
Maskless photolithography
Maskless photolithography
Minimum pattern size ~800 nm
Location: cleanroom at the first floor
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