Year Wise - Major Milestones:
2024
Global Patent Published - Title: "Cover lens and a method of fabricating a cover lens" Applications in Cars (Patent) (Google Patent Link)
2024
Editorial Article Published - Title: Robotic AI-Driven Communication Modules for Enhanced Piezo-Metamaterial Sensing and Structural Health Monitoring, Journal of Materials Applied Science 5(1): 1010 (Article)
2021 – Present
Associate Editor for Sensor Devices (Link: Loop | Venu Gopal Madhav Annamdas)
2021
Interacted with Media, Minister and High-level Officials in Singapore. (Selected Viewing) - YouTube
NTU-Continental Corp Lab, April 2021. During Grand Launch of Corp Lab. Minster: Wang, Transportation Ministry, Singapore
2018
Introduced – Robotic-arm for Metamaterial based Structural Health Monitoring Applications:
Annamdas V. G. M and Soh C. K (2018) Application of Metamaterial Surface Plasmon and Waveguide for Robotic-Arm Based Structural Health Monitoring, Springer’s Journal of Nondestructive Evaluation, Vol 37(2) : 34
2017
Introduced — Time domain/ real time acquisition in EMI technology
Annamdas V. G. M and Soh C. K (2017) Load monitoring using calibrated piezo diaphragm based impedance strain sensor and wireless sensor network in real time, Smart Materials and Structures, Vol 26(4) : 045036
2016
Introduced —A new breed of metamaterials for health of engineering structures:
Annamdas V. G. M and Soh C. K (2016) “Contactless load monitoring in near-field with surface localized spoof plasmons—A new breed of metamaterials for health of engineering structures”, Sensors and Actuators A: Physical, Volume 244, Pages 156–165 Doi:10.1016/j.sna.2016.04.037
2015
Keynote Article @ Stanford University (USA)
Title: Applications of Structural Health Monitoring Technology in Asia 10th International Workshop on Structural Health Monitoring 2015 (September 1-3, 2015), Authors: CK Soh, VGM Annamdas, S Bhalla. Microsoft PowerPoint - IWSHM2015 keynote - Soh C.K., et al.pptx (stanford.edu) (Article published in 2017)
2013
Filed Provisional Patent (Singapore) Title: Electromechanical Charge Density (EMCD) and Wave Form Propagation (WFP) Methods for Diagnostics of Engineering Materials, Components and Structures”, Inventors: Venu Gopal Madhav ANNAMDAS, Hock Lye John PANG, Filed from: School of Mechanical and Aerospace Engineering, Applicant: Nanyang Technological University,Singapore . Grant (Valid: July 2013 –July 2014) ETPL Ref: SRC/Z/07571, NTU Ref: TD/194/12, A*STAR Grant No: 112 290 4014
2013
Most downloaded and cited article of the year in Journal of intelligent material systems and structures. I.F 2.11 Annamdas V. G. M and Radhika M. A (2013) "Electromechanical Impedance of Piezoelectric Transducers for Monitoring Metallic and Non Metallic Structures: A review of Wired, Wireless and Energy Harvesting Methods" Journal of Intelligent Material Systems and Structures, Volume 24, Issue 9, June 2013 pp. 1019 - 1040. Link: Most Downloaded Papers 2013
2012
Technical Disclosure submitted to NTU on Electromechanical Charge Density (EMCD) and Wave Form Propagation (WFP) Methods, Singapore [TECH/194/12]
2011 – 2019
Academic Editor, International Journal of “Advances in Civil Engineering”, Hindawi
2011
Young Scientist Research Grant, Dept. of Science and Technology, Govt. India, Delhi (Link)
2009
Session Chair: [Session 11: Modeling and Design of Smart Systems], Date: Tuesday 10 March 2009, Title : “Sensors and Smart Structures Technologies for Civil, Mechanical, and Aerospace Systems”. SPIE, San Diego, California, USA. Proceedings of SPIE Volume 7292, Dates: 8 - 12 March 2009. Documents.pdf http://spie.org/profile/Venu-Gopal.Annamdas-71211?SSO=1