Embedded Files
Peer-reviewer:
Peer-reviewer:
SAE International Journal of Materials and Manufacturing
SAE International Journal of Aerospace
SAE International Journal of Vehicle Dynamics, Stability, and NVH
Journal of Reinforced Plastics and Composites
Mentoring:
Mentoring:
Hung Wang, UG, UW Seattle: Mentored Hung on composite mold design, vitrimer preparartion and using low temperature plasma for composites. Continued his research and transitioned to masters at UW Seattle
Eric Behling,UG, UW Seattle: Helped in basic understanding of materials engineering. We both developed a gantry system for automated plasma treatment of composites. Continued his research and transitioned to masters at UW Seattle
Lily Nordyke, UG, UW Seattle: Basic understanding and use of goniometer. ImageJ analysis for contact angle, optical profilometer.
Alex Ngyugen, UG, UW Seattle: Composite coating and its testing as per ASTM standards
Somesh Pratap Singh, UG, IITGN, Intern at UW Seattle: Bayesian Optimization for plasma parameters for paint coating. Work published at CAMX 2024 Conference proceedings. Joined Cornell University for his PhD
Andre Lagron, Masters, MSE UW Seattle: Manufacturing and Mechanics of vitrimer based carbon fiber composites
Camdin Monson, UG, CEI Fellow,UW Seattle: Mold design for healing of vitrimer composites. Planning to continue research at Vashisth Lab.
Skills:
Skills:
Domains: Automotive Engineering, Material Failure Analysis, Mechanics of Materials, Polymer Science
CAD/CAE softwares: ANSYS Mechanical and HFSS, CATIA, MSC ADAMS, COMSOL, modeFRONTIER Tools and Protocols: Python, MATLAB, Arduino, DFMEA, CASA X-ray photo-electron spectroscopy software, Origin.
Material Characterization Tools: Mechanical testing of composites and polymers,X-ray diffractometer (XRD), Optical microscopy, Confocal microscopy, Optical profilometry, Goniometer for contact angle analysis, Scanning electron (SEM), Dynamic mechanical (DMA), Raman spectroscopy, Differential scanning calorimetry (DSC), FT-IR, Rheometer, TGA, Fracture and Fatigue of materials, X-ray/CT, Energy Dispersive Spectroscopy, Digital Image Correlation (DIC), Ultrasonic NDT.
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