Thermoelectricity is the direct conversion of temperature differences into electric voltage and vice versa. This phenomenon is utilized in thermoelectric generators (TEGs) to convert waste heat into electricity and in thermoelectric coolers to create temperature gradients. Key applications include waste heat recovery, remote power generation, and precise temperature control in various industries. The efficiency of thermoelectric materials continues to improve, opening new possibilities for sustainable energy solutions.
Altermagnetism is a unique magnetic state found in certain ideal crystals, characterized by fully compensated spin angular momenta and broken parity-time (PT) symmetry. Unlike traditional antiferromagnets, altermagnets exhibit spin-split electronic bands without generating net magnetization. This intriguing property makes them potential candidates for advanced spintronic applications, where they can be used for efficient charge-to-spin conversion and other spin-relevant phenomena.
Research into altermagnetism is still in its early stages, but the potential applications are vast. From advanced memory storage solutions to innovative sensors and quantum computing components, altermagnets hold the promise of revolutionizing various technological fields. As scientists continue to explore the properties and behaviors of these materials, altermagnetism is expected to play a significant role in the future of materials science and condensed matter physics.
Topological insulators are unique materials that act as insulators in their bulk but have conductive states on their surfaces or edges. These surface states are protected by time-reversal symmetry and remain conductive even in the presence of non-magnetic impurities. Topological insulators are classified into two types: 2D topological insulators, which have edge states with dissipationless transport, and 3D topological insulators, which have surface states forming a Dirac cone. These materials have potential applications in spintronics, quantum computing, and other advanced technologies due to their robust and distinctive properties.
It includes the sample grinding and plashing to a micron size, and then making 5-6 wire connections on those 200-300 micron size samples for transport measurements by connecting the wires on a puck.