Call for Paper

The Centre of Excellence for Micro System Technology (MiCTEC), Universiti Malaysia Perlis (UniMAP) is proud to organize the International Symposium on Microelectronic Engineering & Design (isMED) 2024 that will be held between 2 - 3 December 2024 in Penang, Malaysia. 

isMED 2024 invites submissions in the form of original research papers, case studies, and review articles. We encourage submissions on a wide range of topics relevant to the following 7 conference tracks:

• Low-Power Analog Circuit Design.

• Mixed-Signal IC Design.

• High-Frequency Circuit Design for 6G.

• Noise and Distortion in Analog Circuits.

• Data Converters (ADC/DAC) Design.

• Analog Signal Processing.

• RF Power Amplifiers for 6G.

• Phase-Locked Loops (PLLs) and Frequency Synthesizers Design.

• Analog IC Layout Techniques.

• Emerging Technologies in Analog, RF, and 6G Design.

• AI & IoT related circuits, devices and applications

• Digital integrated circuits and signal processing

• Embedded systems design / Processors/ Multiprocessors

• Low Power Tools and Designs Techniques

• Design experience with advanced design technologies

• Memory / Array Structure Design

• Reconfigurable architectures & FPGA-based designs

• Hardware security, cryptography

• Hardware-Software Co-Design and Co-Verification

• Industrial IoT devices and systems

• Test, Fault Tolerance, Reliability and Modelling

• Integrated Circuits for Communications

• Physical Design of Integrated Circuits and Systems

• Computer and Processor Architecture=

• Embedded System and Software

• Reconfigurable Architectures

• VLSI Systems and Applications

• Digital System Design

• System-on-Chip

• Network-on-Chip

• Electronic Design Automation

• Artificial Intelligent

• Advanced Packaging

• Interconnection Technologies

• IC Testing

• Materials and Processing

• Emerging Packaging Technologies

• Quality, Reliability and Failure Analysis

• Mechanical Simulation & Characterization

• Electrical Simulation & Characterization

• Thermal Simulation & Characterization

• Smart Manufacturing

• Mechanical, thermal, and magnetic sensors and actuators, and system

• Opto-mechanical microdevices and microsystems

• Fluidic microcomponents and microsystems

• Microdevices for data storage

• Microdevices for biomedical engineering

• Micro chemical analysis systems

• Microdevices and systems for wireless communication

• Microdevices for power supply and energy harvesting

• Nano-electro-mechanical devices and systems

• Design, simulation and analysis tools with experimental verification

• Fabrication technologies and processes

• Silicon and non-silicon materials

• Electro-mechanical integration techniques

• Assembly and packaging approaches

• Metrology and operational evaluation techniques

• System architecture

• Nanostructures Materials and Nanodevices

• Semiconductor

• Advanced materials

• Bio-materials

• Magnetic Materials

• Optoelectronic Materials

• Energy conversion materials & Devices

• Functional Polymers and Ionic Liquid

• Electro-active ceramics

• Theoretical/modeling/computer simulations of functional Materials

• Piezo and Ferro Electric Materials

• Liquid Crystals

• Coatings and corrosion

• Sensors

• Nuclear Materials

• Organic Electronics

• Sustainable technology

• Smart materials

• Advanced Lithography Techniques

• Etching and Deposition Processes

• Semiconductor Metrology

• Defect Detection and Analysis

• Material Characterization Techniques

• Chemical Mechanical Planarization (CMP)

• High-k/Metal Gate Technology

• Reliability Testing and Analysis

• Process Integration Challenges

• Nano-Scale Fabrication Techniques

• 3D IC Fabrication

• Surface and Interface Engineering

• Photonic Device Fabrication

• Characterization of Semiconductor Nanostructures

• Optoelectronic Devices

• Photonic Integrated Circuits (PICs)

• Nanophotonics and Plasmonics

• Quantum Optoelectronics

• Optoelectronic Sensors and Imaging Systems

• Laser Technologies and Applications

• Energy Harvesting and Solar Cells

• Wearable and Flexible Optoelectronics

• Advanced Optoelectronics for Communication