The present IEEE EPS&NTC Student Branch Chapters Summit is a meeting organized for students, having two important goals: to present them some of new trends in electronics packaging filed and to know each other and start collaboration between them. 

This is the 5th summit and it will be held in Târgoviște, Romania, on 27th October 2026 as part of 32nd International Symposium for Design and Technology in Electronics Packaging (SIITME2026).

The current edition brings together students from IEEE EPS and NTC Student Branch Chapters from Bulgaria, Hungary, and Romania, providing a valuable opportunity for representatives of these chapters to connect, exchange experiences, and build relationships. It also offers an excellent opportunity to explore the latest trends in electronics packaging and nanotechnology through lectures delivered by experts actively involved in these fields.