The present IEEE EPS&NTC Student Branch Chapters Summit is a meeting organized for students, having two important goals: to present them some of new trends in electronics packaging filed and to know each other and start collaboration between them. 

This is the 3rd summit and it will be held in Sibiu, Romania, on 15th October 2024 as part of 30th International Symposium for Design and Technology in Electronics Packaging (SIITME2024).

The current edition brings together students from IEEE EPS&NTC Student Branch Chapters from Bulgaria, Hungary, and Romania, being an environment where the representatives of these chapters to know each other and excellent opportunity for them to find out the new trends in Electronics Packaging and nanotechnology, from lecturers that are deeply involved in these domains.