HYBRID INTEGRATED CIRCUIT BOARDS

Standard structural components are often used in the development of hybrid integrated circuits. Advanced thick-film materials allow to implement a wide range of topological structures, which in turn provide a solution to almost any design idea.

The ability to metallize and fill holes with a conductor, providing breakdown voltages in the interlayer insulator in a wide range of values, creation of specialized coatings for solving assembly problems, production of precision resistors and many other possibilities - this is the potential of modern thick-film technology.