Manufacturing Introduction

Thick Film Manufacturing Line Over the years, we have developed a very mature process such as through holes, resistors on top of dielectrics and multilayer circuitry with as many as 14 separate depositions. All these process capabilities give us the maximum flexibility and enable us to choose the most economic approach for high density packaging. Laser as well as air abrasive trimmer is employed to trim thick film resistance with less than 0.5% tolerance.This capability of holding close tolerance in trimming resistors enables us to manufacture very precise circuits. Also we achieve remarkable repeatability in our production lot.We offer both SIP and DIP circuits as per the customer’s requirements. All kinds of SMD Components can be mounted by reflow soldering. All Circuits are 100% electrically tested using dedicated test stations simulating the required test conditions. We offer a choice of conformal coatings/potting for rugged performance in harsh environments.