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IMG_1156.movFrom March 2023 to January 2024, I worked with Professor Wendy X. Gu and the PhD students of the Gu Lab and took part in the development of a novel 3D printing system for metal nanoparticles to bring about coherent PCB component assembly. My task was to develop a nanoparticle ink composition by specifying the best-performing types and ratios of solvents, and utilize this information to develop an applicable ink across multiple nanoparticles for reliable printing. Through literature review and an extensive trial-and-error process, I was able to quantitative and qualitatively collect data, analyze the results against a series of criteria, and recommend the best composition for the group.
Commercial copper link print results. Every square is printed with a different power and speed, so the best printing configuration can be obtained.
Sample custom copper nanoparticle ink. The solvent is a mixture of wettable organic solutions and a dispersant binding to the nanoparticles.
Print results of commercial copper ink (scanning electron microscope (SEM) image). The uniform layer structure that formed at the bottom-left is the desired result.
Print results of custom nickel ink (SEM image).
Particle binding is observed but most are still disjoint.
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