Semiconductor metrology systems face challenges as they transition between inspection modes, spectroreflectometry to spectroscopic ellipsometry, across multiple points on a 300mm wafer. As throughput requirements continue to rise, these systems must operate at higher measurement speeds, placing increased demands on motor-driven and pneumatically controlled components. In the absence of a system redesign, the risk of particle shedding and contamination continues to rise. This project investigates methods to reduce defects in semiconductor metrology systems by characterizing the chemical properties of lubricant grease and evaluating the effects of repeated mechanical cycling in critical components. The study focuses on the Linear Turret and ZT box, which operate in close proximity to the wafer loading region. Lubricant degradation in these components releases airborne particles that contribute to wafer defects. The formulation of lubricants was studied to assess their impact on stability and wear. Lubricant greases with a base chemistry of multiply-alkylated cyclopentanes (MAC) and polytetrafluoroethylene (PTFE) as a thickener had a lower oil separation value and improved resistance to friction-induced degradation. To evaluate particle generation, components were cycled at high speeds (~1200 RPM) through their full range of motion. High particle counts were observed during initial operation. Continued cycling led to a reduction in particle counts. Overall, this study supports the use of optimized lubrication and mechanical conditioning to reduce defects in semiconductor metrology systems.