Condensed matter physics experiments

• Microwave electronic elements made from high kinetic inductance materials

Fabrication and characterization of microwave circuit elements such as resonators and noise filters made from high kinetic inductance superconducting materials.

• Josephson junction circuits and phase slip phenomena

Application and experimental understanding of Josephson junction dynamics at different E_J and E_C regime, currently focused on phase slip phenomena in Josephson junctions.

• Low temperature transports for graphene and 2DEG system

Electric and thermal electric transport properties under quantum Hall regime or high electric displacement fields for two dimensional electron systems.

• Spin injection with non-local spin valve system

Metal- and graphene- based non-local spin valves.

• Development of novel experimental skills

Novel skills such as stencil lithography and ultra-thin layers material transfer techniques.

Integration of CMOS technology & through transistor IC stacking

• Integration of chip-on-wafer-on-substrate (CoWoS) structure, including devices fabrication (high-k metal gate and FinFET technology) and product packaging (through silicon via (TSV) & bump formation, IC stacking).

• Capacitance and signal integrity for through silicon via formed in device wafers for through transistor stacking techniques.