Microfluidic Bubble Point Prediction

In this project, a novel fluids bubble point measuring device is developed using microfluidics. The required microchannel network is etched on a P-type silicon substrate by wet lithography. This channel is assembled to a 7740 pyrex wafer by anodic bonding.

The sample fluid pressure was supplied by a pressure tank & Piston accumulator. The pressure was regulated using a high-pressure regulator and the use of three pressure gauges that were installed at different points of the system. 

A small heat supply is mounted on the back of the silicon substrate & it is in contact with the channel with thermal grease. 

The system is tested using butane fluid up to 35 bar pressure. We successfully determined the bubble point of different fluids, with superior performance to conventional methods in terms of required process time, and low volumes of sample fluid. For fabrication of this high-pressure microchip a custom anodic bonder was designed and developed in SIBlab.