Conference

2017

  • September 27 - 29: 23rd International Workshop on Thermal Investigations of ICs and Systems (THERMINIC), Amsterdam, The Netherlands
  • April 3 - 4: International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE 2017), Dreden, Germany.

2016

2015

2014

2013