Ming-Chao (Klay) is a seasoned semiconductor industry professional. Currently, Klay is a Product Application Engineer specializing in signoff tools at Synopsys, after serving as a Field Application Engineer there for two years. Previously, Klay was a Program Manager at Taiwan Semiconductor Manufacturing Company Limited (TSMC) for 1.5 years, a Senior Engineer at MediaTek Inc. for 4.5 years, and a Senior Engineer at Global UniChip Corp. (GUC) for one year. Klay also conducted research as a Visiting Research Scholar at Carnegie Mellon University’s Department of ECE in Pittsburgh, PA, for 8 months.
Klay holds a Ph.D. in Computer Science from National Tsing Hua University (2006–2012). His research interests include low-power design methodology, reliability for advanced technology, and 3DIC signoff methodology.